Hirose’s FX23 series hybrid power and signal board-to-board connector features a high-speed transmission capability up to 8 Gbps and a highly reliable floating contact mechanism that simplifies assembly. The FX23 series is designed for a wide range of high-speed applications including medical devices, office imaging equipment, measurement equipment, industrial computer systems, automotive navigation and audio systems, broadcast equipment, base station transceivers, industrial machinery, and more.

Features and Benefits

• ± 0.6 mm (max.) floating in XY directions allows for precise alignment when using multiple board-to-board connectors on one assembly
• High-speed transmission up to 8 Gbps reduces bitrate errors
• Two power pins on each side of the connector housing (3 A/pin) eliminates the need to route power through multiple signal contacts
• Signal terminal rated up to 0.5 A/pin
• Stacking heights for parallel connection: 15 mm to 30 mm, for right angle: 15.9 mm to 20.9 mm allows for design flexibility
• Accepts conformal coating at SMT leads to protect contacts in harsh environments
• Low-profile parallel connection (stacking height: 8 mm, 10 mm, and 12 mm) for use in thin assemblies)
• Excellent mating alignment with large guide posts prevents contact damage