| Image | Part # | Description | Series |
|---|---|---|---|
 |
Mfr.#: 904-27-2-12-2-B-0 |
BOARD LEVEL HEAT SINK | |
 |
Mfr.#: 905-29-1-21-2-B-0 |
HEAT SINK ELLIP FIN 29X29MM CLIP | |
|
Mfr.#: 905-29-2-21-2-B-0 |
HEAT SINK PIN FIN 29X29MM CLIP | |
|
Mfr.#: 905-29-2-33-2-B-0 |
HEAT SINK PIN FIN 29X29MM CLIP | |
|
Mfr.#: 907-33-2-23-2-B-0 |
HEAT SINK PIN FIN 33X33MM CLIP | |
|
Mfr.#: 908-35-1-15-2-B-0 |
HEAT SINK ELLIP FIN 35X35MM CLIP | |
|
Mfr.#: 901-19-1-15-2-B-0 |
HEAT SINK ELLIP FIN 19X19MM CLIP | |
 |
Mfr.#: 173-9-240P OMO.#: OMO-173-9-240P-WAKEFIELD |
THERM PAD 19.1MMX12.7MM GRAY | |
 |
Mfr.#: 422C-330SSG OMO.#: OMO-422C-330SSG-WAKEFIELD |
WEDGELOCK 3.30" GOLD CHROMATE | |
|
Mfr.#: 426C-330SSG OMO.#: OMO-426C-330SSG-WAKEFIELD |
WEDGELOCK 3.30" GOLD CHROMATE | |
|
Mfr.#: 422C-330SSG-P OMO.#: OMO-422C-330SSG-P-WAKEFIELD |
WEDGELOCK 3.30" GOLD CHROMATE | |
|
Mfr.#: 426C-330SSG-P OMO.#: OMO-426C-330SSG-P-WAKEFIELD |
WEDGELOCK 3.30" GOLD CHROMATE | |
 |
Mfr.#: 422C-330SSB OMO.#: OMO-422C-330SSB-WAKEFIELD |
WEDGELOCK 3.30" ANODIZE | |
|
Mfr.#: 426C-330SSB OMO.#: OMO-426C-330SSB-WAKEFIELD |
WEDGELOCK 3.30" ANODIZE | |
|
Mfr.#: 422C-330SSG-CP OMO.#: OMO-422C-330SSG-CP-WAKEFIELD |
WEDGELOCK 3.30" GOLD CHROMATE | |
 |
Mfr.#: 637-10ABPE OMO.#: OMO-637-10ABPE-WAKEFIELD |
Heat Sink Passive TO-220 Vertical Thru-Hole Aluminum 5.8C/W Black Anodized | |
|
Mfr.#: 173-7-1212P OMO.#: OMO-173-7-1212P-WAKEFIELD |
Thrml Mgmt Access Thermal Insulator Gray 0.33°C/W 3X10e-3Cal/cm.sec.°C 1X10e15Ohm.cm | |
|
Mfr.#: D10650-40T1E OMO.#: OMO-D10650-40T1E-WAKEFIELD |
HEATSINK 100PQFP COMPOSITE | |
|
Mfr.#: D10650-40T3 OMO.#: OMO-D10650-40T3-WAKEFIELD |
HEATSINK 100PQFP COMPOSITE | |
|
Mfr.#: D10650-40T5 OMO.#: OMO-D10650-40T5-WAKEFIELD |
HEATSINK 100PQFP COMPOSITE | |
|
Mfr.#: D10850-40T4E OMO.#: OMO-D10850-40T4E-WAKEFIELD |
HEATSINK 128PQFP COMPOSITE | |
 |
Mfr.#: 287-1AB OMO.#: OMO-287-1AB-WAKEFIELD |
HEATSINK TO-220 VERT W/TABS BLK | |
|
Mfr.#: 143-L OMO.#: OMO-143-L-WAKEFIELD |
CLAMP COMPRESSION SYSTEM | |
|
Mfr.#: 145-E OMO.#: OMO-145-E-WAKEFIELD |
Heat Sinks Compression Mounting Clamp Assemblies for Semiconductors to 114.3mm Diameter, 120.7mm to 139.7mm, 228.6mm Height | |
|
Mfr.#: 146-C OMO.#: OMO-146-C-WAKEFIELD |
CLAMP COMPRESSION SYSTEM | |
 |
Mfr.#: 180-12-6C OMO.#: OMO-180-12-6C-WAKEFIELD |
COLD PLATE HEAT SINK 0.038C/W | |
 |
Mfr.#: 401K OMO.#: OMO-401K-WAKEFIELD |
Heat Sinks HEAT SINK TO-3 HORZ DBL FIN | |
 |
Mfr.#: 641K OMO.#: OMO-641K-WAKEFIELD |
HEATSINK TO-3 HORZ MT NO HOLES | |
 |
Mfr.#: 642-45AB OMO.#: OMO-642-45AB-WAKEFIELD |
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized | |
 |
Mfr.#: 647-15ABP OMO.#: OMO-647-15ABP-WAKEFIELD |
HEATSINK TO-220 W/PINS BLK 1.5" | |
 |
Mfr.#: WAVE-35-21 OMO.#: OMO-WAVE-35-21-WAKEFIELD |
BOARD LEVEL HEAT SINK | |
 |
Mfr.#: 180-10-12C OMO.#: OMO-180-10-12C-WAKEFIELD |
Heat Sink Passive 0.041°C/W | |
|
Mfr.#: 301K OMO.#: OMO-301K-WAKEFIELD |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x19.1mm | |
|
Mfr.#: 301M OMO.#: OMO-301M-WAKEFIELD |
HEATSINK, Thermal Resistance:4.67°C/W, Packages Cooled:-, External Width - Metric:50.8mm, External Height - Metric:50.8mm, External Length - Metric:19.1mm, External Diameter - Metric:-, Heat Si | |
|
Mfr.#: 302M OMO.#: OMO-302M-WAKEFIELD |
HEAT SINK, Thermal Resistance:3.33°C/W, Packages Cooled:-, External Width - Metric:50.8mm, External Height - Metric:50.8mm, External Length - Metric:38.1mm, External Diameter - Metric:-, Heat S | |
 |
Mfr.#: WAVE-35-15 OMO.#: OMO-WAVE-35-15-WAKEFIELD |
BOARD LEVEL HEAT SINK | |
|
Mfr.#: 303M OMO.#: OMO-303M-WAKEFIELD |
Heat Sinks Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, (1) 10-32UNF, 0.625 Inch Thread Depth | |
|
Mfr.#: 303N OMO.#: OMO-303N-WAKEFIELD |
HEAT SINK, Thermal Resistance:2.47°C/W, Packages Cooled:-, External Width - Metric:50.8mm, External Height - Metric:76.2mm, External Length - Metric:76.2mm, External Diameter - Metric:-, Heat S | |
|
Mfr.#: 630-45ABT4E OMO.#: OMO-630-45ABT4E-WAKEFIELD |
HEATSINK FOR BGAS FIN HGT .45" | |
|
Mfr.#: 630-45AB OMO.#: OMO-630-45AB-WAKEFIELD |
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized | |
|
Mfr.#: 490-6K OMO.#: OMO-490-6K-WAKEFIELD |
HEATSINK KING SIZE HIGH PWR RECT | |
 |
Mfr.#: VC-106-82-3 OMO.#: OMO-VC-106-82-3-WAKEFIELD |
LIQUID COLD PLATE HEAT SINK | |
|
Mfr.#: 144-B OMO.#: OMO-144-B-WAKEFIELD |
Thrml Mgmt Access Clamp Compression System | |
|
Mfr.#: 146-D OMO.#: OMO-146-D-WAKEFIELD |
CLAMPS & ACCESSORIES - COMPRESSION CLAMP ASSEMBLIES FOR SEMICONDUTORS TO 3.50IN. | |
|
Mfr.#: 143-J OMO.#: OMO-143-J-WAKEFIELD |
CLAMP COMPRESSION SYSTEM | |
|
Mfr.#: 143-D OMO.#: OMO-143-D-WAKEFIELD |
CLAMPS & ACCESSORIES - COMPRESSION CLAMP ASSEMBLIES FOR SEMICONDUTORS TO 3.50IN. | |
|
Mfr.#: 143-B OMO.#: OMO-143-B-WAKEFIELD |
CLAMPS & ACCESSORIES - COMPRESSION CLAMP ASSEMBLIES FOR SEMICONDUTORS TO 3.50IN. | |
 |
Mfr.#: 180-10-6C OMO.#: OMO-180-10-6C-WAKEFIELD |
Heat Sink Passive 0.084C/W | |
|
Mfr.#: 145-A OMO.#: OMO-145-A-WAKEFIELD |
Precision Compression Mounting Clamp Systems | |
|
Mfr.#: 146-B OMO.#: OMO-146-B-WAKEFIELD |
CLAMPS & ACCESSORIES - COMPRESSION CLAMP ASSEMBLIES FOR SEMICONDUTORS TO 3.50IN. |