TE Connectivity AMP MTA interconnection systems are utilized to distribute low current signals throughout electronic equipment. The MTA-100 and MTA-156 interconnection systems are used for wire-to-board or wire-to-wire applications using insulation displacement contacts, or IDCs.
Mass termination of wires provides the lowest applied cost because it drastically reduces the labor content of virtually any required cable or harness assembly. The MTA-100 IDC connector system is a wire-to-board and wire-to-wire system with contacts in a single row on .100 in [2.54 mm] centerline. The design features wire feed-through capability for daisy-chain applications. The MTA-156 IDC connector system is a wire-to-board and wire-to-wire system with contacts in a single row on .156 in [3.96 mm] centerline. Insulation displacement contacts are used to terminate a wide range of conductor sizes. Ribbon cable can also be terminated when the appropriate receptacle assembly and strain relief cover are used. Header assemblies for board mount applications include right-angle and vertical mount products available in through-hole and surface mount configurations.