Low Profile, High Power Chip

By Riedon 71

Low Profile, High Power Chip

Riedon's modern, high-power surface mount chips replace standard TO-126 (25 W) SMT packages with a PCB pad compatible chip only 1 mm (0.04”) thick, a decrease in thickness of over 75%. In addition to the size advantage, the PFC is over 25% less expensive than standard TO style SMT packages.

The back of the chip is metallized for excellent thermal dissipation to your PCB and/or heat sink. Wrap around terminations bring the connections to the top of the chip where a high quality, power film resistor resides.

Applications
  • Battery charger and management
  • Power electronics
  • Power consumption meters
  • Electronic load equipment
  • Automotive

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