PowerFLAT™ 8x8 HV

PowerFLAT™ 8x8 HV

STMicroelectronics' power surface mount package gives engineers the capability of designing denser, more efficient power conversion stages. It accommodates all of ST's high voltage Power MOSFET technologies.

Features
  • Low profile
  • Smaller footprint
  • Same power capability as D2PAK
  • Increased efficiency
Applications
  • SMPS: switched mode power supply
  • Solar micro-inverters
  • AC/DC adapters or chargers
  • Electronic fluorescent ballasts

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