By FTDI, Future Technology Devices International Ltd 116


FTDI's X-Chip Series of Full Speed USB device bridges offer more interface options with lower power, lower pin count, and higher levels of integration. The devices all include an internal MTP memory for configuring and storing the device descriptors and an internal clock source. Both these features result in a lower cost solution for a reduced Bill of Materials and lower PCB real estate required to realize the design.

  • Battery charging detection to enable higher current, faster charging
  • Extensive clocking features; internal clock generation and external clock out
  • Integrated crystal and MTP memory to save board space and maximize flexibility
  • Internal 3.3 V level converter
  • Extended temperature range support, -40° to +85°C
  • Low power consumption:
    • < 8 mA active (typ)
    • < 125 uA suspend (typ)
  • Supports 1.8 V to 3.3 V interfacing with 5 V tolerance