TE Connectivity's zSFP+ pluggable I/O interconnect was designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds. The product is backwards-compatible to SFP+ products in footprint, mating interface, and cage dimensions to allow for easy drop-in replacement within current communication systems.
For newer equipment designs, the zSFP+ interconnect can support either 10 Gbps Ethernet or 16 Fibre Channel Gbps data rates, while accommodating a long-term upgrade path for 28 or potentially 40 Gbps performance. This equates to long-term cost savings as the product eliminates the need to fully redesign or reinstall communication equipment for higher performance.
The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32 G (28.05 Gbps line rate). The entire product family is offered as a dual-source option with Molex Incorporated.
| Features |
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- Data Rates
- 28 Gbps up to potentially 40 Gbps
- Surface-mount connector design
- Press-fit cages for one-step, easy PCB placement
- Coupled, narrow-edged, blanked-, and formed-contact geometry and insert molding for superior signal integrity, mechanical, and electrical performance
- Backwards compatibility: Shares same PCB footprint, mating interface, and cage dimensions with the SFP+ connector
- EMI containment offered in either elastomeric gasket or spring finger options
- Single-port high cages (1 x N) for design flexibility/accommodates belly-to-belly applications to increase density while saving PCB space
- Offers stacked cages in 2 x 1, 2 x 2, 2 x 4, 2 x 6, 2 x 8, 2 x 10, and 2 x 12 port configurations
- Heat sinks, LEDs, and plating choices offered for various design specifications
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- Mechanical
- Mating force: 25 N
- Unmating force: 11.5 N
- Durability (min.): 250 cycles
- Electrical
- Voltage (max.): 120 V max
- Current (max.): 0.5 A
- Dielectric withstanding voltage: 300 VAC between contacts
- Physical
- High-temperature thermoplastic housing (glass filled, UL 94V-0 black)
- High-performance copper alloy contacts
- Nickel underplating, tin plating on solder tail area, and gold plating on mating area
- Operating temperature: -40°C to 85°C
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| Applications |
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- Telecommunications
- Cellular infrastructure
- Access routers and switches
- Servers
- Switches
- Data center
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- Medical
- Medical diagnostic equipment
- Networking
- Network interface
- Switches
- Routers
- Test and measurement equipment
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