InvenSense's ITG-3400 is a single-chip, digital-output, three-axis MEMS gyro IC with programmable full-scale ranges of ±250, ±500, ±1000, and ±2000 degrees/sec (dps), which is useful for precision tracking of both fast and slow motions. Factory-calibrated initial sensitivity reduces production-line calibration requirements. The on-chip FIFO simplifies system timing and lowers system power consumption. The FIFO allows a system microcontroller to burst-read the sensor data and then go to sleep while the ITG-3400 collects more data.

Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% variation from -40°C to +85°C, an embedded temperature sensor, and programmable interrupts. Parts are available with a Fast-Mode I²C serial interface, a V_DD operating range of 1.71 V to 3.6 V, and a V_DDIO voltage from 1.71 V to 3.6 V.

By leveraging its patented and volume-proven InvenSense Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the ITG-3400 package size down to a footprint of 3 x 3 x 0.9 mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging to address a wide-range of handheld consumer electronic devices. The device provides the highest robustness by supporting 10,000 g shock in operation. The highest cross-axis isolation is achieved by design from its silicon integration.