In-line with its pursuit of high-technology products, Abracon Corporation has launched its 3.2 mm x 1.6 mm, 5.2 mm x 2.1 mm, 6.0 mm x 2.0 mm, 7.0 mm x 2.0 mm, 8.0 mm x 1.0 mm, and 9.0 mm x 2.0 mm multilayer ceramic packaged chip antennas. These solutions provide a low-cost, low-profile, high-performance option for wireless equipment, smart phone, and WLAN manufacturers working in the 2275 MHz to 3110 MHz frequency range.

The AMCA series of chip antennas offer peak gains from 3 dBi to 0.5 dBi, with bandwidths from 90 MHz to 200 MHz, depending on the antenna dimensions. The employed multilayer technology provides a very low-profile (1.0 mm to 1.2 mm) and lightweight range of chip antennas, suitable for space constrained applications. This varied range of package offering enables designers to exploit excellent gain and directivity performance, dependent on the package size.

AMCA devices are designed for applications covering ISM bands, WiFi, Bluetooth and Zigbee at 2.4 GHz, China Mobile Multimedia Broadcasting (CMMB) at 2635 to 2660 MHz, and other IMT bands (2.3 GHz to 2.4 GHz and 2.5 GHz to 2.69 GHz) used by WLAN. The AMCA antennas also cover portions of the WiMax (IEEE-802.16) bands that operate globally between 2 GHz to 11 GH (3.5 GHz in Europe) for Fixed WiMax and 2 GHz to 6 GHz for Mobile WiMax, in addition to several LTE TDD bands.

These antennas offer a VSWR of <2:1 across the entire operating range, and are designed to match into 50 Ω on the end-application PCB. Matching is achieved using capacitors and/or inductors via a simple π-type circuit, extending great flexibility to system designers.