SuperFlash® Memory Devices

By Microchip Technology 121

SuperFlash® Memory Devices

Microchip's SST26WF080B/080BA/016B Serial Quad I/O (SQI) Flash devices utilize a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial Flash devices. SST26WF080B/080BA/016B also supports full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol. Operating at frequencies reaching 104 MHz, SST26WF080B/080BA/016B enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. SST26WF080B/080BA/016B writes (Program or Erase) with a single power supply of 1.65 V to 1.95 V and significantly lower-power consumption. 

This memory device’s low-power consumption makes it the ideal choice for mobile handset, Bluetooth®, GPS, camera module, table, hearing aid, and any battery powered devices. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability.

The SST26WF016B default at power up is with WP# and HOLD pins enable and SIO3 and SIO4 pins disable allowing for SPI protocol operations without register configuration.

Features
  • Serial interface architecture: nibble-wide multiplexed I/O’s with SPI-like serial command structure
  • Mode 0 and mode 3
  • x1/x2/x4 Serial Peripheral Interface (SPI) protocol - burst modes
  • Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
  • Page-program: 256 Bytes per page in x1 or x4 mode
  • Flexible erase capability: Uniform 4 KByte sectors, four 8 KByte top and bottom parameter overlay blocks, one 32 KByte top and bottom overlay block, uniform 64 KByte overlay blocks
  • Software write protection: individual block-locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
  • Low-power consumption: Active read current: 15 mA (typical at 104 MHz), standby current: 10 µA (typical)
  • SFDP (Serial Flash Discoverable Parameters)
  • Packages available: 8-contact WSON (6 mm x 5 mm), 8-lead SOIC (150 mil), 8-contact USON (2 mm x 3 mm) SST26WF080B/080BA, 8-ball XFBGA (Z-Scale)
  • All devices are RoHS compliant


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