Littelfuse's SP1012 series packs five ESD diodes in a 0402 size (0.94 mm x 0.61 mm) flip-chip package that normally contains only one. The ESD protection device targets products for growing wearables and consumer markets. Featuring a flip-chip package the silicon itself is the package and electrical connections are the die itself, including plated leads for solderability. This helps circuit designers economize on both printed circuit board (PCB) space and costs.
The robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The bidirectional configuration provides symmetrical ESD protection for data lines when AC signals are present. A single device can protect five lines against an ESD attack, and it is suited for use on SIM card interfaces and data lines for capacitive touchscreen displays.
| Features and Benefits |
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- Five ESD diodes in a 0402 size footprint (0.94 mm x 0.61 mm) represents a 5x improvement over previous implementations, saving PCB area/cost
- ESD protection beyond the maximum rating in the IEC61000-4-2 standard gives engineers more design margin and higher end product reliability in the field
- Supports low clamping voltages needed for protecting modern electronics filled with small-geometry ICs
- Designer friendly; permits flexible routing, connecting to closest available ground
- Standoff voltages enable protection of 95 percent of all interfaces
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- Permits back-to-back 6 V standoff
- Flexible ground connection; any I/O pad will work
- Very low dynamic resistance of 0.48 Ω
- Sets a new standard and new paradigm: most ESD protection diodes per square millimeter
- Promotes high ESD immunity and superior protection
- ESD: IEC61000-4-2, ±15 kV
- Lightning: IEC61000-4-5, 3 A
- EFT: IEC61000-4-4, 40 A
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- TVS Diode Products
- eBook Format
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- TVS Diode Arrays - ESD Suppressors for I/O Interface
- SPA Family of TVS Diode Arrays
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