The Dual Cool 88 N-channel MOSFETs are produced using ON Semiconductor advanced PowerTrench process and delivered in an industry-first 8 x 8 PQFN package. Combining advancements in both silicon and Dual Cool package technologies offer the lowest R_DS(ON) while maintaining excellent switching performance with extremely low junction-to-ambient thermal resistance.

ON Semiconductor’s trench silicon technology, Dual Cool packaging proves to be a clear leader in both power density and thermal performance. Dual Cool packaging technology provides both bottom- and top-side cooling in the industry-standard PQFN package which also provides performance flexibility for designers. With enhanced dual-path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink provides even more impressive results. Dual Cool solutions are lead-free and RoHS-compliant.

The Dual Cool 88 portfolio currently provides coverage from 60 V to 150 V, with 30 V and 40 V devices available in the future.