NTCC Series NTC Thermistor Die

By Vishay/BCcomponents 60

NTCC Series NTC Thermistor Die

Vishay’s NTCC series of leadless NTC thermistor die have top and bottom contacts of either silver or gold metallization making them ideal for wire bonding applications (aluminum or gold lead wire depending on metallization type).  Gold metallization supports conductive adhesive gluing while silver metallization is compatible with reflow soldering and nano-silver paste sintering.  The NTCC Series offers high accuracy, long-term stability over a wide temperature range of -55°C to +175°C, fast response time of 3 seconds, and is AEC-Q200 qualified.  The NTCC series features R25 values that are adapted to the resistivity of the thermistors' stable ceramic material, ultimately preserving its original electrical properties throughout its lifetime, even at high temperatures, and is available in accuracies down to ±1%.  The NTCC thermistor die is delivered in blister-tape packaging.  The high temperature rating and long term stability make the NTCC ideal for temperature sensing, control, protection, and compensation in high-power industrial and automotive applications.  Specific applications include IGBT power modules for H-EV, wind, solar power inverters, and protection circuitry for IC and semiconductor modules.

Features and Benefits Applications
  • Monolithic wire bondable NTC thermistors with gold or silver top/bottom terminations
  • Ideal for wire bonding (aluminum or gold depending on metallization type)
  • Extended operating temperature range of -55°C to +175°C
  • R25 values from 4.7 KΩ to 20 KΩ with tolerances down to ±1%
  • Beta (B25/85) values from 3435 K to 3865 K with ±1% tolerance
  • Fast response time of 3 seconds
  • High stability across temperature range (∆R drift < 3% after 1000 temperature cycles)
  • Highly resistant to thermal shocks
  • AEC-Q200 compliant
  • IGBT modules
  • Power inverters
  • Motor drives
  • Electric vehicle hybrid integrated circuits
  • Solar and wind systems

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