TVS Diode Array for Portable Electronics SP3312T S

By Littelfuse Inc 461

TVS Diode Array for Portable Electronics SP3312T S

Littelfuse's SPA family of TVS diode array devices are designed to protect electronics from very fast and often damaging voltage transients, such as lightning and electrostatic discharge (ESD). They offer an ideal protection solution for analog and digital I/O interfaces for markets including consumer, telecommunications, industrial, medical, computing, and more.

ESD is an electrical transient that poses a serious threat to electronic circuits. The most common cause is friction between two dissimilar materials, causing a buildup of electric charges on their surfaces. Typically, one of the surfaces is the human body and it is not uncommon for this static charge to reach a potential as high as 15,000 volts. At 6,000 static volts, an ESD event will be painful to a person. Lower voltage discharges may go unnoticed, but can still cause catastrophic damage to electronic components and circuits. These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation.

Features

  • Excellent surge protection; peak pulse power: 250 W
  • Negligible variability in capacitance over operating voltage range: 0.3 pF (typ.) (V= 0 to 2.5 V)
  • 15 A peak current ESD protection: ESD, IEC 61000-4-2, ±30 kV contact, ±30 kV air discharge; EFT, IEC 61000-4-4, 40 A; lightning, IEC 61000-4-5, 15 A
  • Small form factor µDFN-08 package (1.8 mm x 2.0 mm x 0.554 mm) allows straight-through routing

 

Microsite Link: SPA Family of TVS Diodes Arrays

PTM Link: TVS Diode Arrays - ESD Suppressors for I/O Interfaces

Littelfuse TVS Diode Array
(PDF Format)   (eBook Format)
Benefits
  • Compared to similar market solutions, the SP3312T series offers far more overhead to electrical threats as defined by regulatory standards
  • Improved signal integrity of the lines the device is protecting, less eye diagram degradation versus competing solutions
  • Allows manufacturers to claim ESD protection above the maximum level stated in the IEC standard and protects against a multitude of other threats to ensure product reliability in the field
  • Allows the PCB trace to be routed underneath the device without the need for stub traces that can cause signal degradation

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