MCP Memory Solutions

By ISSI, Integrated Silicon Solution Inc. 86

MCP Memory Solutions

ISSI's MCP solution enables the miniaturization of feature-rich, low-power applications through the combination of high-performance LPDDR2 DRAM and serial NOR Flash into a small and consistent footprint.

LPDDR2 DRAM Features Serial Flash Features
  • Densities: 
    • 256 Mb
    • 512 Mb
    • 1 Gb
  • Low-voltage core and I/O power supplies
  • VDD2 of 1.2 V
  • VDDCA/VDDQ of 1.2 V
  • VDD1 of 1.8 V
  • Options of x16 or x32
  • High-speed, un-terminated logic (HSUL_12) I/O interface
  • Clock frequency range of 10 MHz to 533 MHz (data rate range of 20 Mbps to 1066 Mbps per I/O)
  • Four-bit, pre-fetch DDR architecture
  • Multiplexed, double-data rate, command/address inputs
  • Four or eight internal banks for concurrent operation
  • Bidirectional/differential data strobe per byte of data (DQS/DQS#)
  • Programmable read/write latencies (RL/WL) and burst lengths of 4, 8, or 16
  • ZQ calibration
  • On-chip temperature sensor to control self-refresh rate
  • Partial-array self-refresh (PASR)
  • Deep power-down mode (DPD)
  • 64 Mb or 128 Mb
  • Industry standard serial interface
  • VDD = 1.8 V
  • 256 bytes per programmable page
  • Supports standard SPI, fast, dual, dual I/O, quad, quad I/O, SPI DTR, dual I/O DTR, quad I/O DTR, and QPI
  • Supports serial Flash discoverable parameters (SFDP)
  • 50 MHz normal and 133 MHz fast read
  • 532 MHz equivalent QPI
  • Dual transfer rate (DTR) up to 66 MHz
  • Selectable dummy cycles
  • Configurable drive strength
  • More than 100,000 erase/program cycles
  • More than 20-year data retention
  • Chip erase with uniform: sector/block erase (4/32/64 Kbyte)
  • Program 1 to 256 bytes per page
  • Program/erase, suspend, and resume
  • Low instruction overhead operations
  • Continuous read 8/16/32/64-byte burst
  • Selectable burst length
  • QPI for reduced instruction overhead
  • AutoBoot operation
Temperature Grades   Package
  • Commercial: 0°C to 70°C
  • Industrial: -40°C to 85°C
  • Automotive, A1: -40°C to 85°C
  • Automotive, A2: -40°C to 105°C
  • Automotive, A25: -40°C to 115°C
 
  • 168-ball PoP BGA
  • Consistent footprint with density migration

New Products:

IS71LD32160WP128-25BPLI

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