Molex's high-durability spring clips offer smartphone makers maximum cost savings with superb interconnect performance over a wide working range. The reduced area on the dimple provides higher contact pressure between mated device and spring clip for enhanced contact reliability. The closed tip prevents accidental snagging of terminal during processing operations. Stopper features on both sides of the clip prevent excess deflection of the terminal when pushed from sideways. Gold plating on the mating contact improves both mechanical and electrical performance of the interconnect when mated.