Vishay Semiconductor Diodes' introduces a series of 45 A to 100 A three-phase bridge power modules in the low-profile MTP PressFit package. Compared to devices incorporating solder contact technology, the Vishay Semiconductors’ VS-40MT160P-P, VS-70MT160P-P, and VS-100MT160P-P dramatically lower production costs.
- Solderless PressFit technology allows for easy one-step PCB mounting to significantly reduce assembly time while simplifying in-field maintenance
- Low 17 mm profile maximizes space savings while optimizing electrical layouts for application-specific power supplies
- Higher reliability and long-term durability compared to solder contact technology
- PressFit package offers increased resistance to shock and vibration, while eliminating issues such as cold spots, voids, splatter, and cracks
- Not subject to solder fatigue, a common failure mechanism in power modules operating at high-temperatures
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- Maximum output current from 45 A to 100 A
- Low-profile MTP PressFit package
- Direct mounting to heatsinks
- 3500 VRMS insulation voltage
- Low forward voltage
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- Low junction-to-case thermal resistance
- Designed and qualified for industrial-level applications
- RoHS-compliant
- UL approved file E78996
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| Applications |
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- AC/DC input rectification in welding machines
- UPS
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- Switch mode power supplies
- Motor drives
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