OSD335x System-in-Package (SiP) Family

By Octavo Systems 51

OSD335x System-in-Package (SiP) Family

Octavo Systems' OSD335x family of SiP products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC and TI TL5209 LDO, up to 1 GB of DDR3 memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package.

With this level of integration the OSD335x family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated high-speed design of the processor/DDR3 interface. It also reduces the overall size and complexity of the design. The OSD335x can significantly decrease the time to market for AM335x-based products.

OSD335x Block Diagram

Features
  • TI AM335x features:
    • ARM® Cortex®-A8 up to 1GHz
    • 8-channel 16-bit SAR AD
    • Ethernet 10/100/1000 x 2
    • USB 2.0 HS OTG + PHY x2
    • MMC, SD, and SDIO x2
    • LCD controller and 3D graphics engine
  • TI AM335x, TPS65217C, TL5209, DDR3, and over 140 passive components integrated into a single package
  • Access to all AM335x GPIOs and peripherals
  • Up to 1 GB DDR3
  • PWR in from 5 VDC, USB, or Li-Ion battery
  • PWR out: 1.8 V, 3.3 V, and Sys
  • 400 ball 1.27 mm pitch BGA (20 x 20)
Benefits
  • Integrates over 140 components into one
  • Compatible with AM335x development tools and software
  • Wide BGA ball pitch allows for low-cost assembly.
  • Significantly reduces design time
  • Decreases layout complexity
  • Saves board space
  • Increased reliability through reduced number of components
  • Power savings and increased performance
    • Shorter signal trace lengths
    • Reduced parasitics
  • 27 mm x 27 mm package size
  • Temperature range: 0°C to +90°C or -40°C to +85°C

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