TAIYO YUDEN Wi-Fi modules feature Marvell Semiconductor chipsets and are ideal for IoT applications. Evaluation boards and evaluation kits are available for easier design. Design support for antennas is available for TAIYO YUDEN Wi-Fi modules.
| WYSACVLXY-XX Features |
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- Chipset: Marvell MW300
- SMD type module. with trace ANT
- IEEE802.11b/g/n conformity
- Channel number : 1 to 11 channel (11bgn)
- Interface: UART, SPI, I2C
- Built-in WLAN front end, Flash memory, Xtal, power circuits
- RoHS conformity
- Security: WPA-2 using AES/CCMP along with legacy security features
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- Advanced Wi-Fi features: 802.11n, Micro-AP mode, client mode, WPS
- Outline: 21.4 mm x 14.0 mm x 2.4 (max) mm
- Package: Metal case package
- FCC, IC, TELEC certified
- HTTP client, HTTPs client, WPS, IEEE power save/Deep sleep, firmware update
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| WYSBHVGXG Features |
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- Chipset: Marvell 88W8887
- SMD type module
- IEEE802.11ac/a/b/g/n 1 x 1 conformity. Data rates up to MCS9 (433.3 Mbps)
- Bluetooth® wireless technology, Class 2
- Low standby current (with low power operation)
- Transmit data rate : 11/5.5/2/1 Mbps (11b), 54/48/36/24/18/12/9/6 Mbps (11a/g),
- 6.5 Mbps to 150 Mbps (11n, MCS7~0, HT20/40), 7.22~433.3 Mbps (11ac MCS9~0, HT80 )
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- Channel number : 1 to 13 channel (11bgn), W52/W53/W56/W58(11ac/11an), 79 channel (BT), 40 channel (BLE)
- Interface : SDIO3.0, PCM
- Built-in diplexer, 2G-PA, 5G-PA, 5G-LNA, OTP, X`tal, DC/DC power
- Security: TKIP, WEP, AES, CCMP, CMAC, WAPI, WPA/WPA2 (64-bit/128-bit)
- Outline: 12.6 mm x 8.9 mm x 1.9 (max) mm
- Package: metal case package
- RoHS conformity
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