zSFP+® Temp-Flex® 28 Gbps Cable Assembly

By Molex Inc 101

zSFP+® Temp-Flex® 28 Gbps Cable Assembly

Molex's zSFP+ Temp-Flex 28 Gbps cable assembly delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications, and now includes Temp-Flex passive cable assemblies and ganged cages utilizing Gen II EMI belly gaskets. It mates with zSFP+ and SFP+ pluggable modules, and has 250 mating cycles. zSFP+ SMT connectors support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications with the ability to support up to 25 Gbps serial lanes. The preferential coupling design uses a narrow-edge, coupled blanked- and formed-contact geometry, and insert molding to optimize electrical performance. The zSFP+ SMT connector shares the same PCB footprint, mating interface and EMI cage dimensions as the SFP+ SMT form factor, making it backward compatible.

Single-port and 1x ganged cages are available to support multiple design options. Single-port cages feature press-fit, solder-post, and PCI (1°) versions, providing a flexible solution for use with various board thicknesses and assembly processes at a comparable cost to SFP+ cages. EMI ganged cages utilizing new Gen II EMI belly gaskets also provide superior EMI shielding compared to SFP+ cages.

The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB space. Cages will offer optional rear- and side-mounted lightpipe cover assemblies to allow for flexibility of PCB signal routing for LEDs.

LC duplex cable assemblies, with optical mode three and four (OM3, OM4) fiber, are used with zSFP+ optical modules. LC duplex assemblies offer a high-performance interconnect solution with customization options for cable length and strain-relief boots including straight, 45°, and 90°. LC loopback assemblies provide a stable and convenient means for testing SFP and SFF devices in many applications.

Temp-Flex 28 Gbps cable assemblies deliver next-generation data rates while delivering significant insertion loss improvements and enhanced cost efficiencies.

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