ESD Protection, 01005 Flip Chip Package – SP3145

By Littelfuse Inc 52

ESD Protection,  01005 Flip Chip Package  – SP3145

Littelfuse introduces an industry first: a new series of three unidirectional TVS diode arrays in space-saving 01005 flip chip packages (0.230 mm x 0.430 mm). Unidirectional protection is typically preferable to bidirectional protection, particularly on logic and data lines, which normally do not transit zero volts during standard operation.

The new SP3145 Series TVS Diode Arrays (SPA® Diodes), based on fast-acting, semiconductor-based technology, can withstand multiple electrostatic discharge (ESD) events without wear-out or degradation. Its low nominal capacitance (0.35 pF) makes this series ideal for interfaces running at high data rates approaching 5 GHz clock speeds.

The general purpose SP1043 (8 pF) and SP1044 (30 pF) Series TVS Diode Arrays employ proprietary silicon avalanche technology to protect the I/O ports of electronic equipment subject to destructive ESD. These robust diodes can safely absorb repetitive ESD strikes at ±12 kV (for SP1043) or ±30 kV (for SP1044) without performance degradation.

Typical applications for these TVS diode arrays include smartphones, digital cameras, wearable technology, tablet computers, and other portable devices.

Catalog and Design Guide: TVS Diode Arrays (SPA®)

Benefits Features
  • Ensures good data integrity while saving PCB space
  • Offers circuit designers more design margin and ensures higher end-product reliability in the field
  • Supports the low clamping voltage needed to protect modern electronics filled with small geometry ICs
  • Low capacitance unidirectional ESD protection in the industry's smallest footprint
  • ESD immunity beyond the maximum rating in the IEC61000-4-2 standard
  • Low dynamic resistance
Applications    
  • Mobile devices
  • Wearable technology
 
  • Smartphones
  • Tablets

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