Samsung's LH351B is built using high technology manufacturing processes and consists of cutting edge materials. To simplify the manufacturing process and reduce forward voltage level, the LH351B is comprised of a flip-chip solution and, to increase ability of color binning supply (MacAdam - 3-step yield), film phosphor technology is adopted. The package structure uses reflective material that could help to reduce yellow ring phenomenon. LH351B is mounted on a ceramic substrate, which features fast heat transfer characteristics, reliability, design freedom of the electrical pad space, and dielectric behavior, and has a small form factor with 1 W to 5 W operation.