BergStik® 2.54 mm Unshrouded Headers

By Amphenol ICC 124

BergStik® 2.54 mm Unshrouded Headers

'sAmphenol ICC BergStik 2.54 mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking, and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2- to 72-positions. Featuring a "breakaway" design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3 A per contact. This product range is extended with BergStik 2.54 mm unshrouded vertical headers in 0.25 μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik product range provides board-to-board, wire to-board, and cable-to-board interconnect solutions for all electronic equipment and devices.

Features Benefits
  • High temperature thermoplastic material
  • Variable spacing height for stacking headers
  • Allow dual entry; mating from top or bottom
  • Blank 0.64 mm square contacts present four surfaces of equal quality
  • Standoff design
  • Duplex plating
  • Tin-lead plating in press-fit area
  • Retention legs option
  • Press-fit designed to fit 1.02 mm diameter hole, solder-to-board product
  • Meets DIN 41651 specification, HE13, and BT D2632
  • Reflow compatible
  • Cater to a wide range of applications
  • Suitable for mezzanine application and give more flexibility in meeting different stack height requirements
  • Can be used for wire wrapping
  • Allow cleaning to remove soldering contamination
  • Cost-efficient
  • Easy pin insertion onto PCB
  • High retention force onto PCB
  • Same layout on THT and press-fit
  • Qualified products

Categories

Top