The introduction of EPC's Gen 5 technology is a quantum leap into a new universe of performance. This latest generation technology cuts the size of the Gen 4 eGaN FET in half but triples their performance. This reduction in cost and improvement in performance creates a “virtuous cycle” that is expanding the gap in both performance and cost between eGaN FETs and ICs and the aging power MOSFET.
Video: GaN takes another quantum leap in performance over silicon
Features
- Small footprint - huge performance gains
- At 100 V the eGaN FETs have a 4 times advantage in RDS(ON) x die area vs. state-of-the-art silicon MOSFETs
- At 200 V this advantage jumps to a 16 times advantage
- Improved figure of merit (FOM)
- The latest generation of eGaN FETs provides a four times advantage over silicon at 100 V and an 8 times advantage at 200 V for improved switching performance in high frequency power conversion applications
- Application benefit from performance gains
- In an example case using the 100 V EPC2045, a 30 percent reduction in power loss with a 2.5 percentage points better efficiency than the best comparable MOSFET was achieved in a 48 V to 5 V circuit operating at 500 kHz switching frequency
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- Open rack server architectures
- LiDAR
- USB-C
- Point-of-load converters
- Class D audio
- LED lighting
- Low inductance motor drives
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- E-mobility
- Wireless charging
- Multi-level AC-DC power supplies
- Synchronous rectification (48 VOUT)
- Robotics
- Solar micro inverters
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