TE Connectivity’s (TE) LGA 3647 socket and hardware meet the next-generation designs for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.
Features
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- Meet next-generation design with LGA 3647 sockets and hardware that meet Intel’s next-generation CPU processors
- Provide higher performance, better system application scaling and better value with new socket and hardware design
- Offer better coplanarity and reliability with a two-piece design that improves issues with warpage
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- Help improve alignment and keep fingers away from the socket contact field with fabric and non-fabric carrier hardware
- Assist in orientation and alignment for the processor heatsink module (PHM) and the spring load force necessary for socket loading with the bolster plate hardware
- Supply mounting points for the bolster plate with back plate hardware
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Applications
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- Data centers
- High-performance computing
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