Sterling-LWB5 Dual-Band 802.11ac Wi-Fi and Bluetoo

By Laird - Embedded Wireless Solutions 84

Sterling-LWB5 Dual-Band 802.11ac Wi-Fi and Bluetoo

LSR, a Laird business, offers the Sterling-LWB5 dual-band 802.11ac Wi-Fi, Bluetooth, and Bluetooth low energy multi-standard module provides users with more options, more certifications, and a greater variety of antenna choices. Altogether this provides greater flexibility to meet the challenging requirements of many wireless designs. The Sterling-LWB5 is one of the very first certified module solutions to meet the growing demand for IEEE 802.11ac capabilities while also offering classic Bluetooth and BLE connectivity. This certified module is based on the Cypress (formerly Broadcom) BCM43353 chipset and supports IEEE 802.11 a/b/g/n/ac WLAN, BT 2.1+EDR, and BLE 4.1 wireless connectivity. The Sterling-LWN enables companies to easily add wireless capabilities to electronic products typically running Linux, with the Sterling-LWB5 offering the additional capabilities of dual-band Wi-Fi with full support of the IEEE 802.11ac standard. The module addresses applications that require dual-band Wi-Fi with cutting-edge 802.11ac capabilities for ultra-high data rates including security and building automation, making enterprise or personal devices "wireless" to connect to the internet, medical devices, M2M applications, vehicle telematics, smart gateways, and other uses to provide wireless connectivity to a multitude of devices and equipment. The module comes in three configurations to best address specific customer applications and features an industrial temperature rating (-40°C to +85° C) and an industry-leading breadth of certifications and antenna options.

Features
  • Delivers IEEE 802.11 ac/a/b/g/n, BT 2.1+EDR, and BLE 4.1 wireless connectivity
  • Provides 802.11ac for high-speed data applications in the 5 GHz band
  • Dual-mode Bluetooth
  • Wi-Fi/Bluetooth co-existence
  • Based on next-generation silicon from Cypress (CYW43353)
  • Available in three configuration options
    • SiP module (10 mm x 10 mm x 1.6 mm)
    • Module with chip antenna (21 mm x 15.5 mm x 2.3 mm)
    • Module with external U.FL antenna port (21 mm x 15.5 mm x 2.3 mm)
  • Antenna and U.FL module versions are both footprint and pin compatible with Sterling-LWB
  • Industrial temperature rating (-40°C to +85° C)
  • Enhanced collaborative co-existence algorithms
  • Direct driver support for Linux
  • SIG certified Bluetooth driver
  • Dev board with SD card form factor for simple connectivity with NXP i.MX 6 and other platforms
  • Broad certifications with multiple antennas: FCC (USA), IC (Canada), ETSI (Europe), Giteki (Japan), and RCM (AU/NZ)
  • Multiple certified antenna options
    • Chip, Dipole, FlexPIFA, and FlexNotch™
    • In-house certification of additional antennas at little to no cost
  • Complimentary 3D antenna scans of products utilizing Sterling-LWB5
Applications
  • Security and building automation
  • Internet of Things / M2M connectivity 
  • Telematics
  • Medical
  • Industrial and home automation
  • Smart gateway and metering
  • Video conferencing
  • Video camera and security
  • Applications requiring industrial temperature rating
  • Applications requiring strong technical support or customization

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