AirMax® VS®, VS2®, VSe® Connec

By Amphenol ICC 86

AirMax® VS®, VS2®, VSe® Connec

Amphenol ICC's AirMax VS connectors use edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The shieldless open pin field design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS connectors address a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications.

The AirMax VS2 connectors provide a migration path from AirMax VS for speeds up to 20 Gb/s, providing margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connector utilizes Amphenol technology for a shieldless design with no metallic plates and closely coupled differential pair designed to yield low loss and low crosstalk. AirMax VS2 connectors are mating-compatible to both AirMax VS and AirMax VSe connectors and require no changes to connector PCB footprints.

Amphenol’s next-generation AirMax VSe connectors provide a migration path for up to 25 Gb/s per differential pair with the flexibility of an open pin field design. The connectors have a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk. Right angle receptacles and right angle headers will support backplane, midplane, or coplanar applications.

AirMax VS Features

  • Innovative shieldless design and air dielectric between adjacent conductors
  • Open pin field design
  • Connector available in modules with 3, 4, or 5 pairs per column and 6, 8, or 10 columns per module; 85 ohm versions also available
  • Simplifies design, supply chain management, inventory, and scheduling
  • Allows designers to choose the right combination for any specific system using common components, reducing cost and lead times
  • Assurance of supply, short lead times, and competitive pricing all reduce risk to the OEM and contract manufacturers
  • Reduces connector cost, weight, and PCB routing complexity
  • Standard configuration and part numbers accelerate design and reduce risk
  • 3 mm pitch between columns enables two different pairs to route between columns, reducing board layer count, complexity, and system cost
  • AirMax VS Datasheet
  • AirMax VS Product Specifications
AirMax VS2 Features AirMax VSe Features
  • Provides a migration path to 20 Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing VS and VS2 designs
  • 3, 4, and 5 pair backplane and coplanar versions are available
  • Available with 0.5 mm or 0.4 mm compliant pins
  • Improved SI with the 0.4 mm tails, same as VSe
  • Can mix-and-match with other metric power and guidance components to create the precise system configuration that is needed
  • AirMax VS2 Datasheet
  • AirMax VS2 Product Specifications
  • Provides a migration path for up to 25 Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing AirMax VS and AirMax VS2 designs
  • 3, 4, and 5 pair backplane and coplanar versions are available
  • Hard metric design practice
  • AirMax VSe Datasheet
  • AirMax VSe Product Specifications
Applications
  • Switches
  • Routers
  • Optical transport
  • Wireless infrastructure
  • Servers
  • External storage systems
  • Supercomputers

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