Low-Profile Solder Cup Headers

By Mill-Max Manufacturing Corp. 174

Low-Profile Solder Cup Headers

Mill-Max's 380 (single row) and 480 series (double row) feature a standoff height of 0.185” (4.7 mm), 0.100” (2.54 mm) pin spacing, and 0.020” (0.51 mm) diameter tails suitable for mating with a variety of sockets or terminating directly to a PCB. The insulator material is Nylon 46 with an HDT of 290°C to withstand most soldering processes. The solder cups are uniformly aligned to facilitate efficient soldering, especially useful for terminating cables, and can accept up to 22 AWG stranded wire. When mated with Mill-Max low-profile board mounted sockets 315-XX-1XX-41-003000 (single row) or 415-XX-2XX-41-003000 (double row) a total interconnect height of 0.280” (7.11 mm) is achieved. They can also mate with Mill-Max standard solder cup sockets 329-XX-1XX-41-540000 (single row) or 429-XX-2XX-41-540000 (double row) for use in wire termination applications such as cable assemblies.

The solder cup pins are precision turned from brass alloy and are plated with 10 µ” gold providing interconnect reliability, corrosion protection, and wear resistance. Connectors are available from 1-64 positions, single row and 2-72 positions double row.

Categories

Top