Molex's SpeedEdge edge-card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. Mechanically robust with thicker walls and higher stack height when compared to SpeedStack connectors and other mezzanine systems and securely holds thick PCBs, delivers durability and high mating cycles. The design includes contacts with a gradual lead-in, lessening the risk of contact stubbing and supporting high-mating cycles. The SpeedEdge accommodates PCBs with blunt chamfers. The low profile (as low as 7.00 mm) provides real estate savings in space-constrained applications. It offers 92 Ω impedance. They are avaliable in multiple circuits sizes of 60 circuits to 82 circuits with ranges in various differential pairs.