TE0782 Series with Xilinx Zynq® Z-7035/Z-7045

By Trenz Electronic 53

TE0782 Series with Xilinx Zynq® Z-7035/Z-7045

Trenz Electronic's TE0782 is an 8.5 cm x 8.5 cm standard footprint SoC module integrating a Zynq Z-7035, a Zynq Z-7045, or Z-7100. It comes with 1 GB DDR3 SDRAM, 4 GB eMMC, 16 GTX high-performance transceiver lanes, 32 MB QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. The Zynq SoC used on the TE0782 board integrates the software programmability of an Arm®-based processor with the hardware programmability of an FPGA, enabling key analytics and hardware acceleration while integrating CPU, DSP, ASSP, and mixed-signal functionality on a single device. A large number of configurable I/Os are provided via rugged high-speed stacking strips. Depending on the customer design, additional cooling might be required. The latest documentation, design support files, and reference designs with source files are available for download free of charge.

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Features
  • 2 x Arm Cortex®-A9 MPCore
  • Rugged for shock and high vibration
  • 2 x Hi-speed USB2.0 ULPI transceiver PHY
  • 2 x Gigabit Ethernet transceiver PHY
  • 2 x Ethernet MAC address EEPROM
  • 1 GB DDR3 SDRAM
  • 32 MB QSPI Flash memory
  • 4 GB eMMC (optional up to 64 GB)
  • Optional 2 MB x 8 MB HyperRAM (max 2 MB x 32 MB HyperRAM)
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Cypress HyperRAM
  • Si5338 PLL for GTX clocking
  • Plug-on module with 3-pin x 160-pin high-speed strips
  • 16 GTX transceiver lanes, GTX transceiver clock input
  • 254 FPGA I/Os (125 LVDS pairs) available on board-to-board connectors
  • On-board high-efficiency DC-DC converters
  • Real-time clock
  • System management and power sequencing
  • Evenly-spread supply pins for good signal integrity
  • User LED
Applications
  • ADAS
  • Medical endoscopes
  • Small cell basebands
  • Professional cameras
  • Machine vision
  • Carrier Ethernet backhaul
  • 4K2K Ultra-HDTVs
  • Multi-function printers

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