Amphenol SV Microwave's line of 3 mm coaxial between board spacing PCB interconnects allows for the lowest stacked height (3 mm) of any board-to-board high frequency coaxial connection system currently available. It is ideal for high-density stacked and high-density multiport applications. Additionally, installation of this line includes options with and without solder.
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- 3 mm board-to-board spacing
- 0.150" minimum pitch between adjacent connectors
- DC to 40 GHz
- Low-force, solderless installation does not damage PCB
- High-density stacked PCB applications
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- Easy to assemble, solderless design reduces yield and assembly time
- Lowest stacked height (3 mm) of any board-to-board high frequency coaxial connection system currently available
- Embedded computing applications
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| Applications |
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- Embedded computing
- High-density stacked PCB applications
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- High-density multiport applications
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