Chip Quik's SMDAL aluminum solder paste uses a tin/silver metal alloy (Sn96.5/Ag3.5) combined with strong water-soluble synthetic flux to bond aluminum heat sinks, aluminum brackets, and aluminum mechanical features to printed circuit boards, copper, brass, and tinned components. The water-soluble flux must be washed off after heating but can be easily removed using hot water at +60°C (+140°F) or isopropyl alcohol. The tin/silver metal alloy is T3 mesh with a particle size of 25 microns to 45 microns, making it suitable for most dispensing applications and most printing applications. This aluminum soldering paste can also be used to solder aluminum to aluminum.

The melting point of the Chip Quik's SMDAL aluminum solder paste is +221°C (+430°F), and Chip Quik recommends achieving a minimum reflow temperature of +249°C (+480°F) to ensure complete reflow of the alloy. Also, if working with higher mass metal components, longer soak time will be required to ensure all metal components reach a sufficient temperature to allow the solder paste to fully reflow between them. For very large metal features, using a heat gun or torch can provide the best heat source. However, if using high powered heating sources like heat gun or torch, be sure to protect sensitive electronic components using a heat shield or reflowing/attaching them post assembly of the heatsink and bracket components to prevent damage to silicon components.

SMDAL aluminum soldering paste is also REACH compliant, Conflict Minerals compliant, and RoHS compliant.