The small diameter segment of the Chip Quik solder sphere line provides precision BGA solder balls in both Sn63/Pb37 and Sn96.5/Ag3.0/Cu0.5 alloys, in diameters as small as 0.008” (0.2 mm). These small diameter solder spheres are manufactured from virgin materials to meet or exceed the requirements of building and repairing BGA packages.

All small diameter solder spheres are also available in 25,000 and 250,000 count packages, easily accommodating small and large BGA re-balling and manufacturing jobs.