TE Connectivity’s ELCON Micro wire-to-board power connectors provide a high current at 12.5 A per pin in the common industry footprint of 3.0 mm. This current density in a compact design is useful for servers, switches, storage devices, and testing machines. A common industry footprint also allows for easy upgrades to existing designs. The connector housing is designed to prevent mating the plug in the wrong direction. This virtually foolproof mating design makes assembly easy for the customer.

Features

• Provide high current at 12.5 A per pin in the common industry footprint of 3.0 mm (contact pitch)
• Support different currents with multiple combinations of different wire sizes and 2- to 24-pin configurations
• A common industry footprint allows for easy upgrades to existing designs
• ELCON Micro headers are PCB footprint compatible with other suppliers
• Virtually foolproof mating makes assembly easy for the customer
• Perform reliably in harsh environments with maximum operating temperature of 105°C and halogen-free material