Nexperia's development of the innovative 4-pin X2SON4 package (SOT1269-2), part of the X2SON MicroPak range, provides the smallest footprint for logic buffers and inverters. X2SON4 is also known as GX4 and is one of the smallest 4-pad logic leadless plastic package for use without a step-down mask since its pad pitch remains ≥0.4 mm. Ten types have been released covering AUP and LVC technologies, including several with Schmitt-trigger and open-drain features.
Applications
- Mobile devices
- Portable computing
- IoT and wearables
- Consumer electronics
Resources
- Nexperia X2SON Ultra-Small MicroPak datasheet
Features
- Small footprint (up to -36% vs. GF and -25% vs. GN packages)
- High contact area-to-chip ratio and enhanced durability
- RoHS and dark-green compliant with nickel-palladium-gold lead-frame finish
- Low profile height (0.35 mm) and low width (0.8 mm)
Benefits
- Lower PCB costs, easier placement, and miniaturization
- No step-down stencil, lowering cost and facilitating assembly
- Future-proof: part of Nexperia's recommended packages
