DEMO9S12NE64E

Mfr. #:: DEMO9S12NE64E
Manufacturer:: NXP / Freescale
Description:: Development Boards & Kits - S08 / S12 9S12NE64 DEMO BOARD
Lifecycle:: New from this manufacturer.
Datasheet:: DEMO9S12NE64E Datasheet
Delivery:: DHL FedEx Ups TNT EMS
Payment:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:

Product Attribute
Attribute Value

Manufacturer:: NXP

Product Category:: Development Boards & Kits - S08 / S12

RoHS:: Y

Product:: Demonstration Boards

Core:: S12

Tool Is For Evaluation Of:: MC9S12NE64

Packaging:: Bulk

Dimensions:: 114.3 mm x 76.2 mm x 31.7 mm

Brand:: NXP / Freescale

Interface Type:: Ethernet, RS-232

Data Bus Width:: 16 bit

Maximum Operating Temperature:: + 50 C

Minimum Operating Temperature:: - 10 C

Operating Supply Voltage:: 3.3 V

Product Type:: Development Boards & Kits - S08 / S12

Factory Pack Quantity:: 1

Subcategory:: Development Tools

Part # Aliases:: 935329217598

Unit Weight:: 2.205 lbs

Tags: DEMO9S1, DEMO9S, DEMO9, DEMO, DEM

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We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
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we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

DEMO9S12NE64E Description

***ical: EVALUATION KIT FOR 9S12NE64 DEMO BOARD

***ment14 APAC: DEMO9S12NE64: Demonstration Board; Silicon Manufacturer:Freescale; Core Architecture:S12; Core Sub-Architecture:S12; Silicon Core Number:MC9S12; Silicon Family Name:S12NE

***ark: DEMO9S12NE64: Demonstration Board; Development Tool Type:Hardware / Software - Eval/Demo Board; Supported Families:S12 and S12X; Tool / Board Applications:General Purpose MCU, MPU, DSP, DSC; Supported Devices:MC9S12NE64 ;RoHS Compliant: Yes

***ical: MCU 16-bit HCS12 HCS12 CISC 64KB Flash 2.5V/3.3V Automotive 80-Pin TQFP Tray

*** Electronics: HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 80-TQFP-EP (14x14)

***ark: 16-Bit Microcontroller IC; Controller Family/Series:S12 Ethernet/USB; Memory Size, Flash:64KB; Memory Size, RAM:8KB; No. of I/O Pins:38; No. of Timers:1; No. of PWM Channels:4; Clock Speed:25MHz; Interface:Ethernet, I2C, SCI, SPI ;RoHS Compliant: Yes

***ment14 APAC: 16BIT MCU 64K FLASH, 9S12, TQFP80; Controller Family/Series:HCS12/S12X; Core Size:16bit; No. of I/O's:38; Program Memory Size:64 KB; RAM Memory Size:7.8KB; CPU Speed:25MHz; Oscillator Type:External; No. of Timers:1; Peripherals:ADC, Timer; Embedded Interface Type:Ethernet, I2C, SCI, SPI; No. of PWM Channels:4; Digital IC Case Style:TQFP; Supply Voltage Range:2.375V to 2.625V, 3.135V to 3.465V; Operating Temperature Range:-40°C to +105°C; No. of Pins:80; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:25MHz; Flash Memory Size:64KB; IC Generic Number:9S12; Interface:I2C, SCI, SPI; Interface:I2C, SCI, SPI; Interface Type:I2C, SCI, SPI; Logic Function Number:64VTUE; Memory Size:64000 B; Memory Type:FLASH; Microprocessor/Controller Features:Ethernet 10/100 Mbps transceiver, 8-channel 10-bit ADC, SPI & SCI interfaces, Internal 2.5-V regulator; No. of ADC Inputs:8; No. of Bits:16; No. of I/O's:37; Operating Temperature Max:105°C; Operating Temperature Min:-40°C; Package / Case:TQFP

***ical: MCU 16-bit HCS12 HCS12 CISC 64KB Flash 2.5V/5V Automotive 112-Pin LQFP Brick

*** Electronics: HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 112-LQFP (20x20)

***nsix Microsemi: Microcontroller, 16-Bit, FLASH, CPU12 CPU, 25MHz, CMOS, PQFP112

***ure Electronics: MC9S12A Series 4 kB RAM 64 kB Flash 16-Bit SMT Flash Microcontroller - LQFP-112

***trelec: Device Core = HCS12 / Data Bus Width Bit = 16 / Instruction Set Architecture = CISC / Family Name = S12A / Clock Frequency Max. MHz = 25 / Program Memory Type = Flash / Program Memory Size kB = 64 / RAM Memory Size kB = 4 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / ADC Channels = 8 / ADC Resolution Bit = 10 / Number of Programmable I/Os = 91 / Number of Timers/Counters = 1 / Supply Voltage Min. V = 4.5 / Supply Voltage Max. V = 5.25 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = LQFP / Pins = 112 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 20 / Width mm = 20 / Height mm = 1.4 / Reflow Temperature Max. °C = 260

***ment14 APAC: 16BIT 64K FLASH MCU, SMD, LQFP112; Controller Family/Series:HCS12/S12X; Core Size:16bit; No. of I/O's:91; Program Memory Size:64 KB; EEPROM Memory Size:1KB; RAM Memory Size:4KB; CPU Speed:25MHz; Oscillator Type:External; No. of Timers:1; Peripherals:ADC, PWM, Timer; Embedded Interface Type:CAN, I2C, SCI, SPI; No. of PWM Channels:8; Digital IC Case Style:LQFP; Supply Voltage Range:2.35V to 2.75V, 4.5V to 5.25V; Operating Temperature Range:-40°C to +85°C; No. of Pins:112; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:25MHz; Flash Memory Size:64KB; Interface:CAN, I2C, SCI, SPI; Interface:CAN, I2C, SCI, SPI; Interface Type:CAN, I2C, SCI, SPI; Logic Function Number:12A64; Memory Size:65536; Memory Type:FLASH; Microprocessor/Controller Features:IIC, SCI, SPI; No. of ADC Inputs:8; No. of Bits:16; No. of I/O's:91; Number of bits In Timer:8; Number of bits in ADC:10; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:64KB

***ical: MCU 16-bit HCS12 HCS12 CISC 64KB Flash 2.5V/3.3V/5V Automotive 112-Pin LQFP Tray

***el Electronic: HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 112-LQFP (20x20)

***ure Electronics: HCS12 Series 64 KB Flash 4 kB RAM 25 MHz 16-Bit Microcontroller - LQFP-112

***ark: S12E 16-Bit Mcu, Hcs12 Core, 64Kb Flash, 50Mhz, Qfp 112 Rohs Compliant: Yes

***ment14 APAC: 16BIT 64K FLASH MCU, SMD, LQFP112; Controller Family/Series:HCS12/S12X; Core Size:16bit; No. of I/O's:90; Program Memory Size:64 KB; EEPROM Memory Size:1KB; RAM Memory Size:4KB; CPU Speed:25MHz; Oscillator Type:External, Internal; No. of Timers:4; Peripherals:ADC, DAC, PWM, Timer; Embedded Interface Type:I2C, SCI, SPI; No. of PWM Channels:6; Digital IC Case Style:LQFP; Supply Voltage Range:2.35V to 2.75V, 2.97V to 5.5V; Operating Temperature Range:-40°C to +85°C; No. of Pins:112; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:25MHz; Flash Memory Size:64KB; Interface:I2C, SCI, SPI; Interface:I2C, SCI, SPI; Interface Type:I2C, SCI, SPI; Logic Function Number:12E64; Memory Size:65536; Memory Type:FLASH; Microprocessor/Controller Features:IIC, SCI, SPI; No. of ADC Inputs:16; No. of Bits:16; No. of I/O's:91; Number of bits In Timer:16; Number of bits in ADC:10; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:64KB

***trelec: Device Core = HCS12 / Data Bus Width Bit = 16 / Instruction Set Architecture = CISC / Family Name = S12E / Clock Frequency Max. MHz = 25 / Program Memory Type = Flash / Program Memory Size kB = 64 / RAM Memory Size kB = 8 / Interfaces = SCI / Interfaces = SPI / ADC Channels = 16 / ADC Resolution Bit = 10 / DAC Resolution Bit = 8 / Number of Programmable I/Os = 90 / Number of Timers/Counters = 3 / Supply Voltage Min. V = 3 / Supply Voltage Max. V = 5.5 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = LQFP / Pins = 112 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 20 / Width mm = 20 / Height mm = 1.4 / Reflow Temperature Max. °C = 260

Market price

Part #	Mfg.	Description	Stock	Price
DEMO9S12NE64E DISTI # V36:1790_07186355	NXP Semiconductors	MC9S12NE64 Microcontroller Demonstration Kit 25MHz CPU 64KB Flash	0	1000:$296.0500 500:$296.0600 100:$298.3500 10:$303.9500 1:$304.9900
DEMO9S12NE64E DISTI # DEMO9S12NE64E-ND	NXP Semiconductors	MC9S12NE64 EVAL BRD RoHS: Compliant Min Qty: 1 Container: Bulk	Temporarily Out of Stock	1:$317.6900
DEMO9S12NE64E DISTI # DEMO9S12NE64E	Avnet, Inc.	EVALUATION KIT FOR 9S12NE64 DEMO BOARD - Boxed Product (Development Kits) (Alt: DEMO9S12NE64E) RoHS: Not Compliant Min Qty: 1 Container: Box	Americas - 0
DEMO9S12NE64E DISTI # DEMO9S12NE64E	Avnet, Inc.	EVALUATION KIT FOR 9S12NE64 DEMO BOARD - Bulk (Alt: DEMO9S12NE64E) RoHS: Not Compliant Min Qty: 1 Container: Bulk	Americas - 0
DEMO9S12NE64E DISTI # DEMO9S12NE64E	Avnet, Inc.	EVALUATION KIT FOR 9S12NE64 DEMO BOARD (Alt: DEMO9S12NE64E) RoHS: Compliant Min Qty: 1	Europe - 0	1000:€294.7900 500:€304.8900 100:€315.7900 50:€327.4900 25:€340.0900 10:€353.6900 1:€368.4900
DEMO9S12NE64E DISTI # 69M1820	NXP Semiconductors	NE64, TCP/IP STACKS, ETHERNET, DEMO BOARD,Silicon Manufacturer:NXP,No. of Bits:16bit,Silicon Family Name:S12NE,Core Architecture:S12,Core Sub-Architecture:S12,Silicon Core Number:MC9S12,Product Range:- RoHS Compliant: Yes	0
DEMO9S12NE64E DISTI # 841-DEMO9S12NE64E	NXP Semiconductors	Development Boards & Kits - S08 / S12 9S12NE64 DEMO BOARD RoHS: Compliant	0	1:$304.9900

Image	Part #	Description
	Mfr.#: DEMO9S08QE32 OMO.#: OMO-DEMO9S08QE32	Development Boards & Kits - S08 / S12 DEMO FOR S08 AND QE32 SI
	Mfr.#: DEMO9S08QG8E OMO.#: OMO-DEMO9S08QG8E	Development Boards & Kits - S08 / S12 MC9S08QH8 DEMO BOARD
	Mfr.#: DEMO9S08RG60 OMO.#: OMO-DEMO9S08RG60-NXP-SEMICONDUCTORS	MC9S08RG60 EVAL BRD
	Mfr.#: DEMO9S08SG32AUTO OMO.#: OMO-DEMO9S08SG32AUTO-NXP-SEMICONDUCTORS	MC9S08SH32/MC9S08SG32 EVAL BRD
	Mfr.#: DEMO9S12XDT512 OMO.#: OMO-DEMO9S12XDT512-NXP-SEMICONDUCTORS	MC9S12XDT512 EVAL BRD
	Mfr.#: DEMO9S08DZ60 OMO.#: OMO-DEMO9S08DZ60-NXP-SEMICONDUCTORS	MC9S08DZ60 EVAL BRD
	Mfr.#: DEMO9S08JM16 OMO.#: OMO-DEMO9S08JM16-NXP-SEMICONDUCTORS	MC9S08JM16 EVAL BRD
	Mfr.#: DEMO9S08MP16 OMO.#: OMO-DEMO9S08MP16-NXP-SEMICONDUCTORS	MC9S08MP16 EVAL BRD
	Mfr.#: DEMO9S08QD4 OMO.#: OMO-DEMO9S08QD4-NXP-SEMICONDUCTORS	MC9S08QD2/MC9S08QD4 EVAL BRD
	Mfr.#: DEMO9S08JS16 OMO.#: OMO-DEMO9S08JS16-NXP-SEMICONDUCTORS	MC9S08JS16 EVAL BRD

DEMO9S12NE64E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes