OMAPL138EZCE3

Mfr. #:: OMAPL138EZCE3
Description:: Digital Signal Processors & Controllers - DSP, DSC C6000 DSP+ARM Processor
Lifecycle:: New from this manufacturer.
Datasheet:: OMAPL138EZCE3 Datasheet
Delivery:: DHL FedEx Ups TNT EMS
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More Information:: OMAPL138EZCE3 more Information OMAPL138EZCE3 Product Details

Product Attribute
Attribute Value

Manufacturer:: Texas Instruments

Product Category:: Digital Signal Processors & Controllers - DSP, DSC

RoHS:: Y

Mounting Style:: SMD/SMT

Package / Case:: PBGA-361

Series:: OMAP-L138

Product:: DSPs

Core:: TMS320C674x, ARM926EJ-S

Maximum Clock Frequency:: 375 MHz, 375 MHz

L1 Cache Instruction Memory:: 32 kB, 16 kB

L1 Cache Data Memory:: 32 kB, 16 kB

Data RAM Size:: 8 kB

Operating Supply Voltage:: 1.2 V

Minimum Operating Temperature:: - 40 C

Maximum Operating Temperature:: + 105 C

Packaging:: Tray

Height:: 0.94 mm

Length:: 13 mm

Width:: 13 mm

Brand:: Texas Instruments

Data ROM Size:: 64 kB

Interface Type:: I2C, Parallel, SPI, USB

Data Bus Width:: 16 bit, 32 bit

I/O Voltage:: 1.8 V, 3.3 V

Instruction Type:: Fixed/Floating Point

L2 Cache Instruction / Data Memory:: 256 kB

MFLOPS:: 2746 MFLOPS

Moisture Sensitive:: Yes

Number of Cores:: 2 Core

Number of Timers/Counters:: 3 Timer

Processor Series:: OMAP

Product Type:: DSP - Digital Signal Processors & Controllers

Factory Pack Quantity:: 160

Subcategory:: Embedded Processors & Controllers

Supply Voltage - Max:: 1.32 V

Supply Voltage - Min:: 1.14 V

Tradename:: OMAP

Watchdog Timers:: Watchdog Timer

Unit Weight:: 0.027845 oz

Tags: OMAPL138EZC, OMAPL138E, OMAPL138, OMAPL1, OMAPL, OMAP, OMA

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OMAPL138EZCE3 Description

***et Europe: DSP Fixed-Point/Floating-Point 32-Bit 375MHz 3648MIPS 361-Pin NFBGA

***as Instruments: C674x DSP+Arm Processor - 456MHz 361-NFBGA 0 to 90

***nell: MPU, 32BIT, ARM9, 375MHZ, NFBGA-361

***i-Key: IC MPU OMAP-L1X 375MHZ 361NFBGA

***ical: SOC OMAPL1xx ARM926EJ-S 361-Pin NFBGA Tray

***ment14 APAC: DSP, 32BIT, 300MHZ, NFBGA-361

***p One Stop Japan: OMAP-L138 C6000 DSP+ARM PROCESSOR

***ark: Omapl138ezce3 Freon 2.3

***AS INSTR: The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

***ASIN: The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

***AS INSTRU: The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

***AS INSTRU: The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

***: The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

***AS INSTRUM: The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a 32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

***AS INSTRUMENTS INC: For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust,” the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects the users’ IP and lets them securely set up the system and begin device operation with known, trusted code.

***INS: Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect user encryption keys. When an update is needed, the customer uses the encryption keys to create a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

***ASIN: The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

***AS INSTRUM: The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

***XS: The Serial ATA (SATA) controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

***AS INSTRUMENTS INC: The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs, or other parallel devices. The uPP supports programmable data widths between 8- to 16-bits on both channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE, and WAIT signals to provide control for a variety of data converters.

***NS: A video port interface (VPIF) provides a flexible video I/O port.

***: The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

***AS USD: The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

OMAPL138EZCE3 More Information

Processors: OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

Market price

Part #	Description	Stock	Price
OMAPL138EZCE3 DISTI # V39:1801_07303354	SOC OMAPL1xx ARM926EJ-S 361-Pin NFBGA RoHS: Compliant	240	500:$16.9500 100:$18.5700 10:$21.3800 1:$23.0799
OMAPL138EZCE3 DISTI # 296-42787-ND	IC MPU OMAP-L1X 375MHZ 361NFBGA RoHS: Compliant Min Qty: 1 Container: Tray	1486In Stock	160:$19.9971 25:$22.3652 10:$23.4180 1:$25.3900
OMAPL138EZCE3 DISTI # 30660279	SOC OMAPL1xx ARM926EJ-S 361-Pin NFBGA RoHS: Compliant	240	100:$18.5700 10:$21.3800 1:$23.0798
OMAPL138EZCE3 DISTI # OMAPL138EZCE3	DSP Fixed-Point/Floating-Point 32-Bit 375MHz 3648MIPS 361-Pin NFBGA - Trays (Alt: OMAPL138EZCE3) RoHS: Compliant Min Qty: 160 Container: Tray	Americas - 0	160:$21.8900 320:$21.3900 640:$20.4900 960:$19.9900 1600:$19.6900
OMAPL138EZCE3 DISTI # OMAPL138EZCE3	DSP Fixed-Point/Floating-Point 32-Bit 375MHz 3648MIPS 361-Pin NFBGA (Alt: OMAPL138EZCE3) RoHS: Compliant Min Qty: 160	Asia - 0
OMAPL138EZCE3	C6000 DSP+ARM Processor	2144	1000:$14.9500 750:$15.0000 500:$16.7100 250:$18.1600 100:$19.0800 25:$21.8400 10:$22.6300 1:$24.3400
OMAPL138EZCE3 DISTI # 595-OMAPL138EZCE3	Digital Signal Processors & Controllers - DSP, DSC C6000 DSP+ARM Processor RoHS: Compliant	129	1:$25.3900 5:$24.3500 10:$23.4200 25:$22.3700 100:$20.0000 250:$19.0800
OMAPL138EZCE3 DISTI # C1S746203694854	OMAP-L138 C6000 DSP+ARM PROCESSOR RoHS: Compliant	240	100:$18.5700 10:$21.3800 1:$23.0798

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OMAPL138EZCE3

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes