XCVU3P-1FFVC1517E

Mfr. #:: XCVU3P-1FFVC1517E
Manufacturer:: Xilinx
Description:: FPGA - Field Programmable Gate Array
Lifecycle:: New from this manufacturer.
Datasheet:: XCVU3P-1FFVC1517E Datasheet
Delivery:: DHL FedEx Ups TNT EMS
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More Information:: XCVU3P-1FFVC1517E more Information XCVU3P-1FFVC1517E Product Details

Product Attribute
Attribute Value

Manufacturer:: Xilinx

Product Category:: FPGA - Field Programmable Gate Array

RoHS:: Y

Product:: Virtex-6

Number of Logic Elements:: 382464

Number of I/Os:: 640 I/O

Operating Supply Voltage:: 1 V

Minimum Operating Temperature:: - 40 C

Maximum Operating Temperature:: + 100 C

Mounting Style:: SMD/SMT

Package / Case:: FBGA-1924

Data Rate:: 6.6 Gb/s, 11 Gb/s

Series:: XC6VHX380T

Brand:: Xilinx

Distributed RAM:: 4570 kbit

Embedded Block RAM - EBR:: 27648 kbit

Maximum Operating Frequency:: 1600 MHz

Number of Transceivers:: 72 Transceiver

Product Type:: FPGA - Field Programmable Gate Array

Factory Pack Quantity:: 1

Subcategory:: Programmable Logic ICs

Tradename:: Virtex

Tags: XCVU3P, XCVU3, XCVU, XCV

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We provide 90-360 days warranty.

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Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

XCVU3P-1FFVC1517E Description

***et: FPGA Virtex UltraScale+ Family 862050 Cells 20nm 0.85V 1517-Pin FCBGA Tray

***inx SCT: Virtex Ultrascale+ FPGA, Speed Grade-1, Logic Cells 862K, C1517, RoHS

***nell: FPGA, VIRTEX ULTRASCALE+, FCBGA-1517

***ark: Fpga, Virtex Ultrascale+, Fcbga-1517; No. Of Logic Blocks:394080; No. Of Macrocells:862050; Fpga Family:virtex Ultrascale+; Logic Case Style:fcbga; No. Of Pins:1517Pins; No. Of Speed Grades:1; Total Ram Bits:25907.2Kbit; No. Of Rohs Compliant: Yes

XCVU3P-1FFVC1517E More Information

Virtex® UltraScale+ Field Programmable Gate Arrays: Xilinx Virtex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver the optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Virtex UltraScale+ devices provide the highest performance and integration capabilities in a FinFET node. These devices also provide 3X system-level performance per-watt compared with 7 series FPGAs. Virtex UltraScale+ devices are ideal for applications ranging from 1+Tb/s networking, smart network interface controller, machine learning, and data center interconnect, to fully integrated radar/early-warning systems. The devices have the highest transceiver bandwidth, highest digital signal processing count, and highest on-chip and in-package memory available in UltraScale architecture.

Market price

Part #	Mfg.	Description	Stock	Price
XCVU3P-1FFVC1517E DISTI # XCVU3P-1FFVC1517E-ND	Xilinx	IC FPGA 520 I/O 1517FCBGA RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$9,975.3000
XCVU3P-1FFVC1517E DISTI # 3132226	Xilinx	FPGA LOGIC ICS RoHS: Compliant	0	1:£8,539.8300
XCVU3P-1FFVC1517E DISTI # 3132226	Xilinx	FPGA LOGIC ICS RoHS: Compliant	0	1:$15,115.5000

Related products

Image	Part #	Description
	Mfr.#: XCVU3P-1FFVC1517E OMO.#: OMO-XCVU3P-1FFVC1517E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU3P-1FFVC1517I OMO.#: OMO-XCVU3P-1FFVC1517I	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU3P-1FFVC1517E OMO.#: OMO-XCVU3P-1FFVC1517E-XILINX	IC FPGA 520 I/O 1517FCBGA
	Mfr.#: XCVU3P-1FFVC1517I OMO.#: OMO-XCVU3P-1FFVC1517I-XILINX	IC FPGA 520 I/O 1517FCBGA

Availability

Stock:: Available
On Order:: 4500
Enter Quantity:

Current price of XCVU3P-1FFVC1517E is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com

Reference price (USD)

Quantity
Unit Price
Ext. Price

1: ~~$9 974.17~~; ~~$9 974.17~~

Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.

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XCVU3P-1FFVC1517E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes