MC9S12XDT256CAL

Mfr. #:: MC9S12XDT256CAL
Manufacturer:: NXP Semiconductors
Description:: IC MCU 16BIT 256KB FLASH 112LQFP
Lifecycle:: New from this manufacturer.
Datasheet:: MC9S12XDT256CAL Datasheet
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More Information:: MC9S12XDT256CAL more Information MC9S12XDT256CAL Product Details

Product Attribute
Attribute Value

Manufacturer: Freescale Semiconductor - NXP

Product Category: Embedded - Microcontrollers

Series: HCS12X

Packaging: Tray

Unit-Weight: 0.045091 oz

Mounting-Style: SMD/SMT

Package-Case: LQFP-112

Operating-Temperature: -40°C ~ 85°C (TA)

Supplier-Device-Package: 112-LQFP (20x20)

Number-of-I-O: 91

Speed: 80MHz

EEPROM-Size: 4K x 8

Core-Processor: HCS12X

RAM-Size: 16K x 8

Program-Memory-Type: FLASH

Peripherals: LVD, POR, PWM, WDT

Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI

Voltage-Supply-Vcc-Vdd: 2.35 V ~ 5.5 V

Core-Size: 16-Bit

Program-Memory-Size: 256KB (256K x 8)

Data-Converters: A/D 16x10b

Oscillator-Type: External

Maximum-Operating-Temperature: + 85 C

Minimum-Operating-Temperature: - 40 C

Operating-Supply-Voltage: 2.5 V 5 V

Interface-Type: CAN I2C SCI SPI

Core: HCS12X

Processor-Series: S12XD

Data-Bus-Width: 16 bit

Maximum-Clock-Frequency: 40 MHz

Number-of-ADC-Channels: 16

Number-of-I-Os: 91 I/O

Data-RAM-Size: 16 kB

Number-of-Timers-Counters: 12 Timer

ADC-Resolution: 10 bit

Tags: MC9S12XDT256CA, MC9S12XDT256C, MC9S12XDT2, MC9S12XDT, MC9S12XD, MC9S12X, MC9S1, MC9S, MC9

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Vacuum Packaging with PL

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MC9S12XDT256CAL Description

***p One Stop Global: MCU 16-bit HCS12X HCS12X CISC 256KB Flash 2.5V/5V 112-Pin LQFP Brick

***ure Electronics: HCS12X Series 256 kB Flash 16 kB RAM 80 MHz 16-Bit Microcontroller - LQFP-112

***et Europe: MCU 16-bit HCS12X CISC 256KB Flash 2.5V/5V 112-Pin LQFP Brick

***escale Semiconductor: S12XD 16-bit MCU, HCS12X core, 256KB Flash, 80MHz, QFP 112

***i-Key: IC MCU 256K FLASH 112-LQFP

***eco: 9S12XDT256TSMC3 GENERAL <AZ

***ark: 16BIT MCU 256K FLASH, SMD, 9S12; SVHC:Cobalt dichloride; Series:HCS12x; Memory Size, Flash:256KB; EEPROM Size:4096Byte; Memory Size, RAM:16384Byte; No of I/O Lines:67; No. of ADC Inputs:16; Timers, No. of:4; PWM Channels, No of:8; ;RoHS Compliant: Yes

***nell: 16BIT MCU 256K FLASH, SMD, 9S12; SVHC:Cobalt dichloride; Series:HCS12x; Memory Size, Flash:256KB; EEPROM Size:4096Byte; Memory Size, RAM:16384Byte; No of I/O Lines:67; No. of ADC Inputs:16; Timers, No. of:4; PWM Channels, No of:8; Clock Frequency:40MHz; Interface Type:I2C, CAN, ECT, PIT, SCI, SPI; Voltage, Supply Min:3.15V; Voltage, Supply Max:5.5V; Termination Type:SMD; Case Style:LQFP; No. of Pins:112; Operating Temperature Range:-40°C to +85°C; Temp, Op. Max:85°C; Temp, Op. Min:-40°C; Base Number:9; IC Generic Number:9S12; Logic Function Number:12XDT256; Memory Size:512KB; Memory Size, Program Memory:256KB; Memory Type:FLASH; Microprocessor/Controller Features:16-channel and 8-channel 10-bit ADCs, 5 CAN 2.0 modules, 8 PWM channels, SCI & SPI modules, 2 Inter-IC Modules, On-Chip Voltage Regulator; No. of Bits:16; Qualified Segment:COMMERCIAL, INDUSTRIAL, AUTOMOTIVE

***ment14 APAC: IC, 16BIT MCU 256K FLASH, SMD, 9S12; Controller Family/Series:HCS12/S12X; Core Size:16bit; No. of I/O's:67; Program Memory Size:256 KB; EEPROM Memory Size:4KB; RAM Memory Size:16KB; CPU Speed:80MHz; Oscillator Type:External; No. of Timers:4; Peripherals:ADC; Embedded Interface Type:CAN, I2C, SCI, SPI; No. of PWM Channels:8; Digital IC Case Style:LQFP; Supply Voltage Range:2.35V to 2.75V, 3.15V to 5.5V; Operating Temperature Range:-40°C to +85°C; No. of Pins:112; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011); Clock Frequency:40MHz; Flash Memory Size:256KB; IC Generic Number:9S12; Interface:CAN, I2C, SCI, SPI; Interface:I2C, SPI, SCI, CAN; Interface Type:CAN, ECT, I2C, PIT, SCI, SPI; Logic Function Number:12XDT256; Memory Size:512KB; Memory Type:FLASH; Microprocessor/Controller Features:16-channel and 8-channel 10-bit ADCs, 5 CAN 2.0 modules, 8 PWM channels, SCI & SPI modules, 2 Inter-IC Modules, On-Chip Voltage Regulator; No. of ADC Inputs:16; No. of Bits:16; No. of I/O's:67

Market price

Part #	Mfg.	Description	Stock	Price
MC9S12XDT256CAL DISTI # V99:2348_07189755	NXP Semiconductors	MCU 16-bit HCS12X HCS12X CISC 256KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray	100	1:$16.5866
MC9S12XDT256CAL DISTI # MC9S12XDT256CAL-ND	NXP Semiconductors	IC MCU 16BIT 256KB FLASH 112LQFP RoHS: Compliant Min Qty: 1 Container: Tray	840In Stock	600:$14.7108 300:$15.4570 10:$18.9750 1:$20.5700
MC9S12XDT256CAL DISTI # 31155002	NXP Semiconductors	MCU 16-bit HCS12X HCS12X CISC 256KB Flash 2.5V/5V Automotive 112-Pin LQFP Tray	100	1:$16.4800
MC9S12XDT256CAL DISTI # MC9S12XDT256CAL	NXP Semiconductors	MCU 16-bit HCS12X CISC 256KB Flash 2.5V/5V 112-Pin LQFP Brick (Alt: MC9S12XDT256CAL) RoHS: Compliant Min Qty: 300	Asia - 0	300:$15.2286 600:$14.8056 900:$14.4054 1500:$14.0263 3000:$13.8442 7500:$13.6667 15000:$13.3250
MC9S12XDT256CAL DISTI # MC9S12XDT256CAL	NXP Semiconductors	MCU 16-bit HCS12X CISC 256KB Flash 2.5V/5V 112-Pin LQFP Brick - Trays (Alt: MC9S12XDT256CAL) RoHS: Compliant Min Qty: 300 Container: Tray	Americas - 0	300:$15.4900 600:$14.8900 1200:$14.2900 1800:$13.7900 3000:$13.4900
MC9S12XDT256CAL DISTI # 24M4749	NXP Semiconductors	MCU, 16BIT, HCS12X, 80MHZ, LQFP-112,Product Range:HCS12X Family S12XD Series Microcontrollers,Architecture:HCS12X,MCU Core Size:16bit,Program Memory Size:256KB,RAM Memory Size:16KB,CPU Speed:80MHz,No. of I/O s:67I/O s,MCU , RoHS Compliant: Yes	220	1:$18.6500 5:$17.7000 10:$17.2000 25:$17.1800 50:$15.9400 100:$14.6900 250:$14.1800
MC9S12XDT256CAL DISTI # 841-MC9S12XDT256CAL	NXP Semiconductors	16-bit Microcontrollers - MCU 9S12XDT256TSMC3 GENERAL RoHS: Compliant	207	1:$18.6500 5:$17.7000 10:$17.2000 25:$17.1800 100:$14.6900 250:$14.1800 500:$13.8600
MC9S12XDT256CAL DISTI # 1165814	NXP Semiconductors	MCU, 16BIT, HCS12X, 80MHZ, LQFP-112 RoHS: Compliant	220	1:$29.5200 5:$28.0100 10:$27.2200 25:$27.1900 100:$23.2500 250:$22.4400 500:$21.9400

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MC9S12XDT256CAL

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes