66AK2E05XABDA25

66AK2E05XABDA25
Mfr. #:
66AK2E05XABDA25
Description:
Digital Signal Processors & Controllers - DSP, DSC Edison 2 ARM, 4 DSP, 1.25Ghz ext temp
Lifecycle:
New from this manufacturer.
Datasheet:
66AK2E05XABDA25 Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
More Information:
66AK2E05XABDA25 more Information 66AK2E05XABDA25 Product Details
Product Attribute
Attribute Value
Manufacturer:
NXP
Product Category:
Digital Signal Processors & Controllers - DSP, DSC
RoHS:
Y
Mounting Style:
SMD/SMT
Package / Case:
QFP-32
Series:
56F801x
Product:
DSCs
Core:
56800E
Maximum Clock Frequency:
32 MHz
Program Memory Size:
16 kB
Data RAM Size:
4 kB
Operating Supply Voltage:
2.5 V
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 125 C
Packaging:
Tray
Height:
1.45 mm
Length:
7 mm
Program Memory Type:
Flash
Width:
7 mm
Brand:
NXP / Freescale
Interface Type:
I2C, LIN, SCI, SPI
Number of I/Os:
26 I/O
ADC Resolution:
12 bit
Data Bus Width:
16 bit
Moisture Sensitive:
Yes
Number of Timers/Counters:
1 Timer
Product Type:
DSP - Digital Signal Processors & Controllers
Factory Pack Quantity:
1250
Subcategory:
Embedded Processors & Controllers
Supply Voltage - Max:
3.6 V
Supply Voltage - Min:
3 V
Part # Aliases:
935310004557
Unit Weight:
0.006653 oz
Tags
66AK2E05, 66AK2E, 66AK2, 66AK, 66A
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***as Instruments
Multicore DSP+Arm, 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE switch 1089-FCBGA -40 to 100
***et
Multicore DSP+ARM KeyStone II System-on-Chip (SoC)
***ark
Edison 2 Arm, 4 Dsp, 1.25Ghz Ext Temp
***AS INSTUMENTS
The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.
***AS INSTUMENTS
TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.
***as Instruments (TI)
TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.
***as Instr.
The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.
***AS INSTRUM
The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.
Processors
OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.
66AK2E05 Multicore DSP+ARM Keystone II SoC
OMO Electronic 66AK2E05 Multicore DSP+ARM Keystone II System on Chip (SoC) is a high-performance device with multicore SoC architecture. This SoC features quad-core ARM Cortex-A15 processors, 2MB of Multicore Shared Memory Controller (MSMC), and TMS320C66x DSP core subsystem. The 66AK2E05 SoC integrates a large amount of on-chip memory and includes a 64bit DDR3 external memory interface. This Keystone II SoC enables to use a variety of development and debugging tools including open source Linux debugging environment. The ideal end equipment includes CT scanner, embedded PC, network attached storage, oscilloscope, X-ray, and ethernet switch. The 66AK2E05 offers 0°C to 85°C of the commercial case temperature and -40°C to 100°C of extended case temperature. Typical applications include consumer electronics, medical, security, space, communication, avionics, and defense.
Part # Description Stock Price
66AK2E05XABDA25
DISTI # 66AK2E05XABDA25-ND
66AK2E05XABDA25
RoHS: Compliant
Min Qty: 40
Container: Tube
Temporarily Out of Stock
  • 40:$154.1110
66AK2E05XABDA25
DISTI # 66AK2E05XABDA25
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) - Trays (Alt: 66AK2E05XABDA25)
RoHS: Not Compliant
Min Qty: 40
Container: Tray
Americas - 0
  • 40:$193.3900
  • 80:$188.6900
  • 160:$181.2900
  • 240:$176.8900
  • 400:$173.6900
66AK2E05XABDA25
DISTI # 595-66AK2E05XABDA25
Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA -40 to 100
RoHS: Compliant
0
  • 1:$164.5400
  • 5:$162.2100
  • 10:$157.5800
  • 25:$156.4300
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Availability
Stock:
Available
On Order:
2000
Enter Quantity:
Current price of 66AK2E05XABDA25 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
Reference price (USD)
Quantity
Unit Price
Ext. Price
1
$164.54
$164.54
5
$162.21
$811.05
10
$157.58
$1 575.80
25
$156.43
$3 910.75
Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
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