XCVU11P-3FLGF1924E

Mfr. #:: XCVU11P-3FLGF1924E
Manufacturer:: Xilinx
Description:: FPGA - Field Programmable Gate Array
Lifecycle:: New from this manufacturer.
Datasheet:: XCVU11P-3FLGF1924E Datasheet
Delivery:: DHL FedEx Ups TNT EMS
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More Information:: XCVU11P-3FLGF1924E more Information XCVU11P-3FLGF1924E Product Details

Product Attribute
Attribute Value

Manufacturer:: Intel

Product Category:: FPGA - Field Programmable Gate Array

RoHS:: Y

Product:: Stratix 10 GX

Number of Logic Elements:: 2110000

Number of Logic Array Blocks - LABs:: 263750

Number of I/Os:: 688 I/O

Operating Supply Voltage:: 0.85 V

Minimum Operating Temperature:: 0 C

Maximum Operating Temperature:: + 100 C

Mounting Style:: SMD/SMT

Package / Case:: FBGA-1760

Packaging:: Tray

Data Rate:: 28.3 Gb/s

Series:: Stratix 10 GX

Brand:: Intel / Altera

Maximum Operating Frequency:: 1 GHz

Moisture Sensitive:: Yes

Number of Transceivers:: 48 Transceiver

Product Type:: FPGA - Field Programmable Gate Array

Factory Pack Quantity:: 12

Subcategory:: Programmable Logic ICs

Tradename:: Stratix

Tags: XCVU11P-3FL, XCVU11P-3, XCVU11, XCVU1, XCVU, XCV

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XCVU11P-3FLGF1924E Description

***et: Virtex UltraScale+ 2835000 Cells 2592000 Registers 74344038 RAM Bit 1924-Pin FCBGA Tray

***i-Key: IC FPGA 624 I/O 1924FCBGA

XCVU11P-3FLGF1924E More Information

Virtex® UltraScale+ Field Programmable Gate Arrays: Xilinx Virtex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver the optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Virtex UltraScale+ devices provide the highest performance and integration capabilities in a FinFET node. These devices also provide 3X system-level performance per-watt compared with 7 series FPGAs. Virtex UltraScale+ devices are ideal for applications ranging from 1+Tb/s networking, smart network interface controller, machine learning, and data center interconnect, to fully integrated radar/early-warning systems. The devices have the highest transceiver bandwidth, highest digital signal processing count, and highest on-chip and in-package memory available in UltraScale architecture.

Market price

Part #	Mfg.	Description	Stock	Price
XCVU11P-3FLGF1924E DISTI # XCVU11P-3FLGF1924E-ND	Xilinx	IC FPGA 624 I/O 1924FCBGA RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$59,147.0100
XCVU11P-3FLGF1924EES9810 DISTI # XCVU11P-3FLGF1924EES9810	Xilinx	- Trays (Alt: XCVU11P-3FLGF1924EES9810) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU11P-3FLGF1924E DISTI # 217-VU11P-3FLGF1924E	Xilinx	FPGA - Field Programmable Gate Array RoHS: Compliant	0	1:$59,147.0000

Related products

Image	Part #	Description
	Mfr.#: XCVU11P-3FLGA2577E OMO.#: OMO-XCVU11P-3FLGA2577E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU11P-3FLGF1924E OMO.#: OMO-XCVU11P-3FLGF1924E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU11P-3FLGB2104E OMO.#: OMO-XCVU11P-3FLGB2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU11P-3FSGD2104E OMO.#: OMO-XCVU11P-3FSGD2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU11P-3FLGC2104E OMO.#: OMO-XCVU11P-3FLGC2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU11P-3FLGA2577E OMO.#: OMO-XCVU11P-3FLGA2577E-XILINX	XCVU11P-3FLGA2577E
	Mfr.#: XCVU11P-3FLGB2104E OMO.#: OMO-XCVU11P-3FLGB2104E-XILINX	XCVU11P-3FLGB2104E
	Mfr.#: XCVU11P-3FLGC2104E OMO.#: OMO-XCVU11P-3FLGC2104E-XILINX	XCVU11P-3FLGC2104E
	Mfr.#: XCVU11P-3FLGF1924E OMO.#: OMO-XCVU11P-3FLGF1924E-XILINX	XCVU11P-3FLGF1924E
	Mfr.#: XCVU11P-3FSGD2104E OMO.#: OMO-XCVU11P-3FSGD2104E-XILINX	XCVU11P-3FSGD2104E

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On Order:: 4500
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Reference price (USD)

Quantity
Unit Price
Ext. Price

1: ~~$59 147.00~~; ~~$59 147.00~~

Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.

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XCVU11P-3FLGF1924E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes