TMS5700432BPZQQ1R

Mfr. #:: TMS5700432BPZQQ1R
Description:: ARM Microcontrollers - MCU Hercules MCU
Lifecycle:: New from this manufacturer.
Datasheet:: TMS5700432BPZQQ1R Datasheet
Delivery:: DHL FedEx Ups TNT EMS
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More Information:: TMS5700432BPZQQ1R more Information TMS5700432BPZQQ1R Product Details

Product Attribute
Attribute Value

Manufacturer:: Texas Instruments

Product Category:: ARM Microcontrollers - MCU

RoHS:: Y

Mounting Style:: SMD/SMT

Package / Case:: LQFP-100

Series:: TMS570LS0432

Core:: ARM Cortex R4

Data Bus Width:: 32 bit/16 bit

Maximum Clock Frequency:: 80 MHz

Program Memory Size:: 384 kB

Data RAM Size:: 32 kB

ADC Resolution:: 12 bit

Number of I/Os:: 45 I/O

Operating Supply Voltage:: 1.14 V to 1.32 V

Minimum Operating Temperature:: - 40 C

Maximum Operating Temperature:: + 125 C

Packaging:: Reel

Product:: MCU

Program Memory Type:: Flash

Brand:: Texas Instruments

Data RAM Type:: RAM

Data ROM Size:: 16 kB

Data ROM Type:: EEPROM

Interface Type:: CAN, JTAG, SPI, UART

Analog Supply Voltage:: 3.3 V

I/O Voltage:: 3 V to 3.6 V

Moisture Sensitive:: Yes

Number of ADC Channels:: 16 Channel

Product Type:: ARM Microcontrollers - MCU

Factory Pack Quantity:: 1000

Subcategory:: Microcontrollers - MCU

Supply Voltage - Max:: 1.32 V

Supply Voltage - Min:: 1.14 V

Watchdog Timers:: Watchdog Timer, Windowed

Unit Weight:: 0.022886 oz

Tags: TMS5700432B, TMS57004, TMS5700, TMS570, TMS57, TMS5, TMS

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TMS5700432BPZQQ1R Description

***as Instruments: 16/32 Bit RISC Flash MCU, Arm Cortex-R4, Auto Q-100 100-LQFP -40 to 125

***i-Key: IC MCU 16/32B 384KB FLSH 100LQFP

***OMO Electronic: The TMS570LS0432/0332 device is a high-performance automotive-grade microcontroller for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and Memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os.

***AS INSTUMENTS: The TMS570LS0432/0332 device integrates the ARM Cortex-R4 CPU. The CPU offers an efficient 1.66DMIPS/MHz, and has configurations that can run up to 80 MHz, providing up to 132 DMIPS. The device supports the big-endian (BE32) format.

***as Instr.: The TMS570LS0432/0332 device has 384KB and 256KB of integrated flash (respectively) and 32KB of data RAM. Both the flash and RAM have single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (the same level as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operates with a system clock frequency of 80 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes throughout the supported frequency range.

***as Instr.: The TMS570LS0432/0332 device features peripherals for real-time control-based applications, including a Next Generation High-End Timer (N2HET) timing coprocessor with up to 19 I/O terminals and a 12-bit Analog-to-Digital Converter (ADC) supporting 16 inputs in the 100-pin package.

***AS INSTRUMEN: The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a small instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

***AS INSRUMENT: The Enhanced Quadrature Encoder Pulse (eQEP) module is used for direct interface with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating machine as used in high-performance motion and position-control systems.

***AS INTRUMENTS: The device has a 12-bit-resolution MibADC with 16 channels and 64 words of parity-protected buffer RAM. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired.

***AS INSTUMENTS: The device has multiple communication interfaces: one MibSPI, two SPIs, one UART/LIN, and two DCANs. The SPI provides a convenient method of serial high-speed communications between similar shift-register type devices. The UART/LIN supports the Local Interconnect standard 2.1 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1Mbps. The DCAN is ideal for applications operating in noisy and harsh environments (for example, automotive and industrial applications) that require reliable serial communication or multiplexed wiring.

***AS INSRUMENT: The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. The FMPLL provides one of the five possible clock source inputs to the Global Clock Module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

***AS INSTRUM: The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

***OMO Electronic: The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external nERROR pin is toggled when a fault is detected. The nERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

***INS: The I/O Multiplexing and Control Module (IOMM) allows the configuration of the input/output pins to support alternate functions. See Table 4-17 for a list of the pins that support multiple functions on this device.

***TEXAS: With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS0432/0332 device is an ideal solution for real-time control applications with safety-critical requirements.

TMS5700432BPZQQ1R More Information

Processors: OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

TMS570LS0x32 32-Bit RISC Flash Microcontrollers: OMO Electronic TMS570LS0x32 32-Bit RISC Flash Microcontrollers are high-performance automotive-grade microcontrollers designed for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and Memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os. The TMS570LS0432/0332 devices integrate the ARM Cortex-R4 CPU. This CPU offers an efficient 1.66 DMIPS/MHz and has configurations that can run up to 80MHz, providing up to 132 DMIPS.

Market price

Part #	Description	Stock	Price
TMS5700432BPZQQ1R DISTI # V36:1790_17087001	TMS570LS0x32 16- and 32-Bit RISC Flash Microcontroller	0	1000000:$5.5350 500000:$5.5380 100000:$5.7460 10000:$6.1060 1000:$6.1650
TMS5700432BPZQQ1R DISTI # V72:2272_17087001	TMS570LS0x32 16- and 32-Bit RISC Flash Microcontroller	0
TMS5700432BPZQQ1R DISTI # V39:1801_17087001	TMS570LS0x32 16- and 32-Bit RISC Flash Microcontroller	0	1000000:$5.5350 500000:$5.5380 100000:$5.7460 10000:$6.1060 1000:$6.1650
TMS5700432BPZQQ1R DISTI # 296-48181-1-ND	IC MCU 32BIT 384KB FLASH 100LQFP RoHS: Compliant Min Qty: 1 Container: Cut Tape (CT)	829In Stock	500:$7.2912 100:$8.3731 10:$10.1140 1:$11.2000
TMS5700432BPZQQ1R DISTI # 296-48181-6-ND	IC MCU 32BIT 384KB FLASH 100LQFP RoHS: Compliant Min Qty: 1 Container: Digi-Reel®	829In Stock	500:$7.2912 100:$8.3731 10:$10.1140 1:$11.2000
TMS5700432BPZQQ1R DISTI # 296-48181-2-ND	IC MCU 32BIT 384KB FLASH 100LQFP RoHS: Compliant Min Qty: 1000 Container: Tape & Reel (TR)	Temporarily Out of Stock	1000:$6.1654
TMS5700432BPZQQ1R DISTI # TMS5700432BPZQQ1R	MCU 32-Bit TMS570 ARM Cortex R4 RISC 384KB Flash 1.2V/3.3V 100-Pin LQFP T/R - Tape and Reel (Alt: TMS5700432BPZQQ1R) RoHS: Compliant Min Qty: 1000 Container: Reel	Americas - 0	10000:$5.6900 6000:$5.7900 4000:$5.9900 2000:$6.2900 1000:$6.5900
TMS5700432BPZQQ1R DISTI # TMS5700432BPZQQ1R	MCU 32-Bit TMS570 ARM Cortex R4 RISC 384KB Flash 1.2V/3.3V 100-Pin LQFP T/R (Alt: TMS5700432BPZQQ1R) RoHS: Compliant Min Qty: 1000 Container: Tape and Reel	Europe - 0	10000:€5.4900 6000:€5.7900 4000:€6.0900 2000:€6.7900 1000:€7.6900
TMS5700432BPZQQ1R	16/32 Bit RISC Flash MCU, Arm Cortex-R4, Auto Q-100	947	1000:$5.1900 750:$5.2100 500:$5.8000 250:$6.3000 100:$6.6200 25:$7.5800 10:$7.8600 1:$8.4500
TMS5700432BPZQQ1R DISTI # 595-MS5700432BPZQQ1R	ARM Microcontrollers - MCU Hercules MCU RoHS: Compliant	1875	1:$10.8700 10:$9.8200 25:$9.0900 100:$8.1300 250:$7.7200 500:$7.0800 1000:$6.1700
TMS5700432BPZQQ1 DISTI # 595-TMS5700432BPZQQ1	ARM Microcontrollers - MCU Corona F021 Rev B RoHS: Compliant	527	1:$10.8700 10:$9.8200 25:$9.0900 100:$8.1300 250:$7.7200 500:$7.0800 1000:$6.1700

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TMS5700432BPZQQ1R

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes