LM3S6610-IBZ25-A2

Mfr. #: LM3S6610-IBZ25-A2
Manufacturer: Texas Instruments
Description: IC MCU 32BIT 128KB FLASH 108BGA Stellaris ARM Cortex-M3S 6000
Lifecycle: New from this manufacturer.
Datasheet: LM3S6610-IBZ25-A2 Datasheet
Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
Product Details
LM3S6610-IBZ25-A2 Overview

Product belongs to the StellarisR ARMR CortexR-M3S 6000 series. Tray Alternate Packaging is the packaging method for this product 108-LFBGA Operational temperature range: -40°C ~ 85°C (TA) Supplier device package: 108-BGA (10x10) This product has 46 I/O ports for versatile connectivity. Operating frequency: 25MHz Program memory type: FLASH Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART interface Supply Voltage: 2.25 V ~ 2.75 V 32-Bit architecture Internal oscillator type

LM3S6610-IBZ25-A2 Image

LM3S6610-IBZ25-A2

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

LM3S6610-IBZ25-A2 Specifications
  • Manufacturer Texas Instruments
  • Product Category Embedded - Microcontrollers
  • Series StellarisR ARMR CortexR-M3S 6000
  • Packaging Tray Alternate Packaging
  • Package-Case 108-LFBGA
  • Operating-Temperature -40°C ~ 85°C (TA)
  • Supplier-Device-Package 108-BGA (10x10)
  • Number-of-I-O 46
  • Speed 25MHz
  • EEPROM-Size -
  • Core-Processor ARMR CortexR-M3
  • RAM-Size 32K x 8
  • Program-Memory-Type FLASH
  • Peripherals Brown-out Detect/Reset, POR, PWM, WDT
  • Connectivity Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
  • Voltage-Supply-Vcc-Vdd 2.25 V ~ 2.75 V
  • Core-Size 32-Bit
  • Program-Memory-Size 128KB (128K x 8)
  • Data-Converters -
  • Oscillator-Type Internal

LM3S6610-IBZ25-A2

LM3S6610-IBZ25-A2 Specifications

LM3S6610-IBZ25-A2 FAQ
  • A: What is the Series of the product?

    Q: The Series of the product is StellarisR ARMR CortexR-M3S 6000.

  • A: What is the Packaging of the product?

    Q: The Packaging of the product is Tray Alternate Packaging.

  • A: At what frequency does the Package-Case?

    Q: The product Package-Case is 108-LFBGA.

  • A: Is the cutoff frequency of the product Operating-Temperature?

    Q: Yes, the product's Operating-Temperature is indeed -40°C ~ 85°C (TA)

  • A: What is the Supplier-Device-Package of the product?

    Q: The Supplier-Device-Package of the product is 108-BGA (10x10).

  • A: Is the cutoff frequency of the product Number-of-I-O?

    Q: Yes, the product's Number-of-I-O is indeed 46

  • A: Is the cutoff frequency of the product Speed?

    Q: Yes, the product's Speed is indeed 25MHz

  • A: Is the cutoff frequency of the product Program-Memory-Type?

    Q: Yes, the product's Program-Memory-Type is indeed FLASH

  • A: What is the Connectivity of the product?

    Q: The Connectivity of the product is Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART.

  • A: At what frequency does the Voltage-Supply-Vcc-Vdd?

    Q: The product Voltage-Supply-Vcc-Vdd is 2.25 V ~ 2.75 V.

  • A: What is the Core-Size of the product?

    Q: The Core-Size of the product is 32-Bit.

  • A: Is the cutoff frequency of the product Oscillator-Type?

    Q: Yes, the product's Oscillator-Type is indeed Internal

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