| Mfr. #: | XC7Z030-1FBG676I |
|---|---|
| Manufacturer: | Xilinx |
| Description: | IC SOC CORTEX-A9 KINTEX7 676FBGA |
| Lifecycle: | New from this manufacturer. |
| Datasheet: | XC7Z030-1FBG676I Datasheet |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 676-BBGA, FCBGA Operational temperature range: -40°C ~ 100°C (TJ) Supplier device package: 676-FCBGA (27x27) Operating frequency: 667MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 125K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z030-1FBG676I Specifications
A: Is the cutoff frequency of the product Series?
Q: Yes, the product's Series is indeed ZynqR-7000
A: At what frequency does the Packaging?
Q: The product Packaging is Tray.
A: Is the cutoff frequency of the product Package-Case?
Q: Yes, the product's Package-Case is indeed 676-BBGA, FCBGA
A: Is the cutoff frequency of the product Operating-Temperature?
Q: Yes, the product's Operating-Temperature is indeed -40°C ~ 100°C (TJ)
A: Is the cutoff frequency of the product Supplier-Device-Package?
Q: Yes, the product's Supplier-Device-Package is indeed 676-FCBGA (27x27)
A: What is the Speed of the product?
Q: The Speed of the product is 667MHz.
A: What is the Architecture of the product?
Q: The Architecture of the product is MCU, FPGA.
A: Is the cutoff frequency of the product MCU-RAM?
Q: Yes, the product's MCU-RAM is indeed 256KB
A: At what frequency does the Connectivity?
Q: The product Connectivity is CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
A: At what frequency does the Primary-Attributes?
Q: The product Primary-Attributes is Kintex-7 FPGA, 125K Logic Cells.