Mfr. #: | XC7Z035-1FFG676C |
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Manufacturer: | Xilinx |
Description: | IC SOC CORTEX-A9 KINTEX7 676BGA |
Lifecycle: | New from this manufacturer. |
Datasheet: | XC7Z035-1FFG676C Datasheet |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 676-BBGA, FCBGA Operational temperature range: 0°C ~ 85°C (TJ) Supplier device package: 676-FCBGA (27x27) Operating frequency: 667MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 275K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z035-1FFG676C Specifications
A: Is the cutoff frequency of the product Series?
Q: Yes, the product's Series is indeed ZynqR-7000
A: Is the cutoff frequency of the product Packaging?
Q: Yes, the product's Packaging is indeed Tray
A: What is the Package-Case of the product?
Q: The Package-Case of the product is 676-BBGA, FCBGA.
A: What is the Operating-Temperature of the product?
Q: The Operating-Temperature of the product is 0°C ~ 85°C (TJ).
A: At what frequency does the Supplier-Device-Package?
Q: The product Supplier-Device-Package is 676-FCBGA (27x27).
A: Is the cutoff frequency of the product Speed?
Q: Yes, the product's Speed is indeed 667MHz
A: At what frequency does the Architecture?
Q: The product Architecture is MCU, FPGA.
A: Is the cutoff frequency of the product MCU-RAM?
Q: Yes, the product's MCU-RAM is indeed 256KB
A: Is the cutoff frequency of the product Connectivity?
Q: Yes, the product's Connectivity is indeed CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
A: What is the Primary-Attributes of the product?
Q: The Primary-Attributes of the product is Kintex-7 FPGA, 275K Logic Cells.