| Mfr. #: | XC7Z035-3FBG676E |
|---|---|
| Manufacturer: | Xilinx |
| Description: | IC SOC CORTEX-A9 KINTEX7 676BGA |
| Lifecycle: | New from this manufacturer. |
| Datasheet: | XC7Z035-3FBG676E Datasheet |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 676-BBGA, FCBGA Operational temperature range: 0°C ~ 100°C (TJ) Supplier device package: 676-FCBGA (27x27) Operating frequency: 800MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 275K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z035-3FBG676E Specifications
A: Is the cutoff frequency of the product Series?
Q: Yes, the product's Series is indeed ZynqR-7000
A: Is the cutoff frequency of the product Packaging?
Q: Yes, the product's Packaging is indeed Tray
A: Is the cutoff frequency of the product Package-Case?
Q: Yes, the product's Package-Case is indeed 676-BBGA, FCBGA
A: Is the cutoff frequency of the product Operating-Temperature?
Q: Yes, the product's Operating-Temperature is indeed 0°C ~ 100°C (TJ)
A: Is the cutoff frequency of the product Supplier-Device-Package?
Q: Yes, the product's Supplier-Device-Package is indeed 676-FCBGA (27x27)
A: Is the cutoff frequency of the product Speed?
Q: Yes, the product's Speed is indeed 800MHz
A: Is the cutoff frequency of the product Architecture?
Q: Yes, the product's Architecture is indeed MCU, FPGA
A: At what frequency does the MCU-RAM?
Q: The product MCU-RAM is 256KB.
A: At what frequency does the Connectivity?
Q: The product Connectivity is CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
A: At what frequency does the Primary-Attributes?
Q: The product Primary-Attributes is Kintex-7 FPGA, 275K Logic Cells.