RM57L843BZWTT

Mfr. #:: RM57L843BZWTT
Description:: ARM Microcontrollers - MCU Hercules RM57Lx LaunchPad Eval Kit
Lifecycle:: New from this manufacturer.
Datasheet:: RM57L843BZWTT Datasheet
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More Information:: RM57L843BZWTT more Information RM57L843BZWTT Product Details

Product Attribute
Attribute Value

Manufacturer:: Texas Instruments

Product Category:: ARM Microcontrollers - MCU

RoHS:: Y

Mounting Style:: SMD/SMT

Package / Case:: NFBGA-337

Series:: RM57L843

Core:: ARM Cortex R5F

Data Bus Width:: 32 bit

Maximum Clock Frequency:: 330 MHz

Program Memory Size:: 4096 kB

Data RAM Size:: 512 kB

ADC Resolution:: 12 bit

Number of I/Os:: 168 I/O

Operating Supply Voltage:: 1.2 V

Minimum Operating Temperature:: - 40 C

Maximum Operating Temperature:: + 105 C

Product:: MCU

Program Memory Type:: Flash

Brand:: Texas Instruments

Data RAM Type:: SRAM

Data ROM Size:: 128 kB

Interface Type:: CAN, I2C, LIN, UART

I/O Voltage:: 3 V to 3.6 V

Moisture Sensitive:: Yes

Number of ADC Channels:: 41 Channel

Processor Series:: Hercules

Product Type:: ARM Microcontrollers - MCU

Factory Pack Quantity:: 90

Subcategory:: Microcontrollers - MCU

Supply Voltage - Max:: 1.32 V

Supply Voltage - Min:: 1.14 V

Watchdog Timers:: Watchdog Timer, Windowed

Unit Weight:: 0.023066 oz

Tags: RM5

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RM57L843BZWTT Description

***as Instruments: 16/32 Bit Arm Cortex-R5F Flash MCU, RISC, EMAC 337-NFBGA -40 to 105

***i-Key: IC MCU 16/32B 4MB FLASH 337NFBGA

***AS INSTUMENTS: The RM57L843 device is part of the Hercules RM series of high-performance ARMÂ® CortexÂ®-R-based MCUs. Comprehensive documentation, tools, and software are available to assist in the development of IEC 61508 functional safety applications. Start evaluating today with the Hercules RM57x LaunchPad Development Kit. The RM57L843 device has on-chip diagnostic features including: dual CPUs in lockstep, Built-In Self-Test (BIST) logic for CPU, the N2HET coprocessors, and for on-chip SRAMs; ECC protection on the L1 caches, L2 flash, and SRAM memories. The device also supports ECC or parity protection on peripheral memories and loopback capability on peripheral I/Os.

***AS INSTRUMENT: The RM57L843 device integrates two ARM Cortex-R5F floating-point CPUs, operating in lockstep, which offer an efficient 1.66 DMIPS/MHz, and can run up to 330 MHz providing up to 547 DMIPS. The device supports the little-endian [LE] format.

***AS INSTRUMENTS INCORPORATED: The RM57L843 device has 4MB of integrated flash and 512KB of data RAM with single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable and programmable memory, implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (the same level as the I/O supply) for all read, program, and erase operations. The SRAM supports read and write accesses in byte, halfword, and word modes.

***as Instruments Inc.: The RM57L843 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors with up to 64 total I/O terminals.

***: The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information or drive actuators with complex and accurate time pulses. The High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

***XS: The Enhanced Pulse Width Modulator (ePWM) module can generate complex pulse width waveforms with minimal CPU overhead or intervention. The ePWM is easy to use and supports both high-side and low-side PWM and deadband generation. With integrated trip zone protection and synchronization with the on-chip MibADC, the ePWM is ideal for digital motor control applications.

***AS INST: The Enhanced Capture (eCAP) module is essential in systems where the accurately timed capture of external events is important. The eCAP can also be used to monitor the ePWM outputs or for simple PWM generation when not needed for capture applications.

***: The Enhanced Quadrature Encoder Pulse (eQEP) module directly interfaces with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating machine as used in high-performance motion and position-control systems.

***AS INSTRUMENT: The device has two 12-bit-resolution MibADCs with 41 total channels and 64 words of parity-protected buffer RAM. The MibADC channels can be converted individually or by group for special conversion sequences. Sixteen channels are shared between the two MibADCs. Each MibADC supports three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired. One of the channels in MibADC1 and two of the channels in MibADC2 can be used to convert temperature measurements from the three on-chip temperature sensors.

***AS INS: The device has multiple communication interfaces: Five MibSPIs; four UART (SCI) interfaces, two with LIN support; four CANs; two I2C modules; and one Ethernet controller. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The LIN supports the Local Interconnect standard (LIN 2.1) and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0B protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for applications operating in noisy and harsh environments (for example, automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The Ethernet module supports MII, RMII, and Management Data I/O (MDIO) interfaces. The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C module supports speeds of 100 and 400 kbps.

***XS: The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module multiplies the external frequency reference to a higher frequency for internal use. The Global Clock Module (GCM) manages the mapping between the available clock sources and the internal device clock domains.

***AS INTRUMENTS: The device also has two External Clock Prescaler (ECP) modules. When enabled, the ECPs output a continuous external clock on the ECLK1 and ECLK2 balls. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

***TEXAS: The Direct Memory Access (DMA) controller has 32 channels, 48 peripheral requests, and ECC protection on its memory. An MPU is built into the DMA to protect memory against erroneous transfers.

***OMO Electronic: The Error Signaling Module (ESM) monitors on-chip device errors and determines whether an interrupt or external Error pin/ball (nERROR) is triggered when a fault is detected. The nERROR signal can be monitored externally as an indicator of a fault condition in the microcontroller.

***as Instruments (TI): The External Memory Interface (EMIF) provides a memory extension to asynchronous and synchronous memories or other slave devices.

***: A Parameter Overlay Module (POM) is included to enhance the debugging capabilities of application code. The POM can reroute flash accesses to internal RAM or to the EMIF, thus avoiding the reprogramming steps necessary for parameter updates in flash. This capability is particularly helpful during real-time system calibration cycles.

***AS INSTRUMEN: Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built-in ARM Cortex-R5F CoreSight debug features, the Embedded Cross Trigger (ECT) supports the interaction and synchronization of multiple triggering events within the SoC. An External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or minimal impact on the program execution time of the application code.

***AS INSTRUMENT: With integrated safety features and a wide choice of communication and control peripherals, the RM57L843 device is an ideal solution for high-performance real-time control applications with safety-critical

RM57L843BZWTT More Information

Processors: OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

RM57L843 16/32-Bit RISC Flash Microcontroller: OMO Electronic RM57L843 16/32-Bit RISC Flash Microcontroller is part of the Hercules RM series of high-performance ARM® Cortex®-R-based MCUs. The RM57L843 integrates two ARM Cortex-R5F floating-point CPUs, operating in lockstep, which offer an efficient 1.66 DMIPS/MHz. These MCUs can run up to 330MHz providing up to 547 DMIPS. The RM57L843 has 4MB of integrated flash and 512KB of data RAM with single-bit error correction and double-bit error detection. This device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors with up to 64 total I/O terminals. This MCU comes with multiple communication interfaces: Five MibSPIs; four UART (SCI) interfaces, two with LIN support; four CANs; two I2C modules; and one Ethernet controller. With integrated safety features and a wide choice of communication and control peripherals, the RM57L843 device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

Market price

Part #	Description	Stock	Price
RM57L843BZWTT DISTI # 296-44700-ND	IC MCU 32BIT 4MB FLASH 337NFBGA RoHS: Compliant Min Qty: 1 Container: Tray	698In Stock	180:$47.0321 90:$50.7540 10:$52.4460 1:$55.8300
RM57L843BZWTT DISTI # RM57L843BZWTT	Hercules MCU - Trays (Alt: RM57L843BZWTT) RoHS: Compliant Min Qty: 90 Container: Tray	Americas - 0	90:$56.3900 180:$55.0900 360:$52.8900 540:$51.5900 900:$50.6900
RM57L843BZWTT DISTI # RM57L843BZWTT	Hercules MCU (Alt: RM57L843BZWTT) RoHS: Compliant Min Qty: 1	Europe - 0	1:€48.0900 10:€46.6900 25:€45.2900 50:€43.9900 100:€42.7900 500:€41.5900 1000:€40.5900
RM57L843BZWTT	16/32-Bit RISC Flash Microcontroller	1722	1000:$38.4500 750:$38.5700 500:$42.9700 250:$45.6800 100:$46.0200 25:$51.7700 10:$53.4600 1:$57.1800
RM57L843BZWTT DISTI # 595-RM57L843BZWTT	ARM Microcontrollers - MCU Hercules RM57Lx LaunchPad Eval Kit RoHS: Compliant	2124	1:$55.8400 5:$54.1400 10:$52.4500 25:$50.7600 90:$50.7600 100:$47.0400

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RM57L843BZWTT

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes