ZSSC3131BA1C

ZSSC3131BA1C
Mfr. #:
ZSSC3131BA1C
Manufacturer:
IDT, Integrated Device Technology Inc
Description:
DICE (WAFER SAWN) - FRAME
Lifecycle:
New from this manufacturer.
Datasheet:
ZSSC3131BA1C Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Product Attribute
Attribute Value
Tags
ZSSC3131BA1, ZSSC3131BA, ZSSC3131, ZSSC313, ZSSC31, ZSSC3, ZSSC, ZSS
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***egrated Device Technology
Sensor Signal Conditioner for Cost Optimized Switch Applications
***i-Key
DICE (WAFER SAWN) - FRAME
Part # Mfg. Description Stock Price
ZSSC3131BA1C
DISTI # ZSSC3131BA1C-ND
Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
RoHS: Not compliant
Min Qty: 2800
Container: Tray
Temporarily Out of Stock
  • 2800:$2.4472
ZSSC3131BA1C
DISTI # ZSSC3131BA1C
Integrated Device Technology IncSensor Signal Conditioner for Cost-Optimized Switch Applications -40 to 125°C Die Sawn on Wafer Frame (Alt: ZSSC3131BA1C)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€2.0900
  • 500:€2.2900
  • 100:€2.3900
  • 50:€2.4900
  • 25:€2.5900
  • 10:€2.6900
  • 1:€2.8900
ZSSC3131BA1C
DISTI # ZSSC3131BA1C
Integrated Device Technology IncSensor Signal Conditioner for Cost-Optimized Switch Applications -40 to 125°C Die Sawn on Wafer Frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3131BA1C)
RoHS: Compliant
Min Qty: 2800
Container: Waffle Pack
Americas - 0
  • 28000:$2.2900
  • 16800:$2.3900
  • 11200:$2.4900
  • 5600:$2.6900
  • 2800:$2.7900
Image Part # Description
ZSSC3170EA3R

Mfr.#: ZSSC3170EA3R

OMO.#: OMO-ZSSC3170EA3R

Sensor Interface DFN / 20 / 6X5MM S1 - TAPE&REEL - 13"
ZSSC3154EA2-T

Mfr.#: ZSSC3154EA2-T

OMO.#: OMO-ZSSC3154EA2-T

Sensor Interface Sensor Signal Conditoner
ZSSC3135BA2R

Mfr.#: ZSSC3135BA2R

OMO.#: OMO-ZSSC3135BA2R

Sensor Interface Sensor Signal Conditoner
ZSSC3154BE3V

Mfr.#: ZSSC3154BE3V

OMO.#: OMO-ZSSC3154BE3V

Sensor Interface PQFN / 32 / 5x5mm# SF - tray
ZSSC3122AI1B

Mfr.#: ZSSC3122AI1B

OMO.#: OMO-ZSSC3122AI1B-1190

WAFER (UNSAWN) - BOX
ZSSC313XBOARDV1P2S

Mfr.#: ZSSC313XBOARDV1P2S

OMO.#: OMO-ZSSC313XBOARDV1P2S-1190

SSC BOARD ZSSC313X V1.2 WITH SAM
ZSSC3154BA1D

Mfr.#: ZSSC3154BA1D

OMO.#: OMO-ZSSC3154BA1D-1190

DICE (WAFER SAWN) - WAFFLE PACK
ZSSC3170EA1B

Mfr.#: ZSSC3170EA1B

OMO.#: OMO-ZSSC3170EA1B-1190

WAFER (UNSAWN) - BOX
ZSSC3170FA2T

Mfr.#: ZSSC3170FA2T

OMO.#: OMO-ZSSC3170FA2T-INTEGRATED-DEVICE-TECH

SSOP / 20 / 5,3mm G1 - tube (Alt: ZSSC3170FA2T)
ZSSC3123AA1C

Mfr.#: ZSSC3123AA1C

OMO.#: OMO-ZSSC3123AA1C-1190

DICE (WAFER SAWN) - FRAME
Availability
Stock:
Available
On Order:
2000
Enter Quantity:
Current price of ZSSC3131BA1C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
Reference price (USD)
Quantity
Unit Price
Ext. Price
1
$0.00
$0.00
10
$0.00
$0.00
100
$0.00
$0.00
500
$0.00
$0.00
1000
$0.00
$0.00
Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
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