PartNumber | 208-7 | 208-75CTE | 208-7391-55-1902 |
Description | Cable Mounting & Accessories | Heat Sinks Heatsink for TO-220, Copper, Channel Style, 19.05x19.05x9.52mm | IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads |
Manufacturer | Heyco | Wakefield-Vette | 3M |
Product Category | Cable Mounting & Accessories | Heat Sinks | Sockets for ICs, Transistors |
Product Type | Cable Mounts | Heat Sinks | - |
Brand | Heyco | Wakefield-Vette | - |
Subcategory | Wire & Cable Management | Heat Sinks | - |
RoHS | - | Y | - |
Product | - | Heat Sinks | - |
Mounting Style | - | Through Hole | - |
Heatsink Material | - | Copper | - |
Length | - | 9.53 mm | - |
Width | - | 19.05 mm | - |
Height | - | 19.05 mm | - |
Designed for | - | TO-220 | - |
Color | - | Gray | - |
Series | - | 208 | Textool |
Type | - | Heat Sink | SOIC |
Factory Pack Quantity | - | 3000 | - |
Packaging | - | - | Bulk |
Termination | - | - | Solder |
Operating Temperature | - | - | -55°C ~ 150°C |
Mounting Type | - | - | Through Hole |
Features | - | - | Closed Frame |
Housing Material | - | - | Polyethersulfone (PES), Glass Filled |
Number of Positions or Pins Grid | - | - | 8 (2 x 4) |
Pitch Mating | - | - | - |
Contact Finish Mating | - | - | Gold |
Pitch Post | - | - | - |
Contact Finish Post | - | - | Gold |
Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 30μin (0.76μm) |
Contact Material Post | - | - | Beryllium Copper |