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| PartNumber | 225-PGM15001-51 | 225-PGM15001-10 | 225-PLS15001-16 |
| Description | IC & Component Sockets PIN GRID ARRAY SOLDER TAIL 225 PINS | IC & Component Sockets | IC & Component Sockets 225P PGA TEST SOCKET |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | N | - | - |
| Product | PGA Sockets | PGA Sockets | - |
| Termination Style | Solder Tail | Solder Tail | - |
| Series | PGM | - | PLS |
| Brand | Aries Electronics | Aries Electronics | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 1 | 1 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Number of Positions | - | 225 Position | - |
| Type | - | Pin Grid Array Socket | PGA, ZIF (ZIP) |
| Pitch | - | 2.54 mm | - |
| Contact Plating | - | Gold | - |
| Row Spacing | - | - | - |
| Current Rating | - | 3 A | - |
| Housing Material | - | Nylon | Polyphenylene Sulfide (PPS) |
| Contact Material | - | Brass | - |
| Flammability Rating | - | UL 94 V-0 | - |
| Lead Length | - | 3.18 mm | - |
| Mounting Style | - | Through Hole | - |
| Maximum Operating Temperature | - | + 125 C | - |
| Minimum Operating Temperature | - | - 55 C | - |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -65°C ~ 200°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Number of Positions or Pins Grid | - | - | - |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Nickel Bronze |
| Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 50μin (1.27μm) |
| Contact Material Post | - | - | Beryllium Copper |